Issued Patents All Time
Showing 601–625 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6112735 | Complete blade and wafer handling and support system without tape | — | 2000-09-05 |
| 6107122 | Direct die contact (DDC) semiconductor package | Alan G. Wood, Ford B. Grigg, Salman Akram | 2000-08-22 |
| 6107119 | Method for fabricating semiconductor components | Alan G. Wood | 2000-08-22 |
| 6107109 | Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate | Salman Akram, Alan G. Wood | 2000-08-22 |
| 6097087 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Alan G. Wood, Mike Brooks | 2000-08-01 |
| 6094734 | Test arrangement for memory devices using a dynamic row for creating test data | Ray Beffa, Eugene H. Cloud, Leland R. Nevill, Ken Waller | 2000-07-25 |
| 6094058 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Alan G. Wood, Salman Akram | 2000-07-25 |
| 6093933 | Method and apparatus for fabricating electronic device | Kevin G. Duesman, Alan G. Wood | 2000-07-25 |
| 6091606 | Semiconductor device including combed bond pad opening, assemblies and methods | Walter L. Moden, Larry D. Kinsman | 2000-07-18 |
| 6089107 | Process for testing a semiconductor device | Robert L. Canella | 2000-07-18 |
| 6091252 | Method, apparatus and system for testing bumped semiconductor components | Salman Akram, Alan G. Wood, David R. Hembree | 2000-07-18 |
| 6089920 | Modular die sockets with flexible interconnects for packaging bare semiconductor die | David J. Corisis, Salman Akram | 2000-07-18 |
| 6087723 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2000-07-11 |
| 6087845 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Tim J. Corbett | 2000-07-11 |
| 6088237 | Semiconductor device socket, assembly and methods | Larry D. Kinsman, Walter L. Moden | 2000-07-11 |
| 6088238 | Semiconductor device socket, assembly and methods | Larry D. Kinsman, Walter L. Moden | 2000-07-11 |
| 6082605 | Continuous mode solder jet apparatus | — | 2000-07-04 |
| 6083820 | Mask repattern process | — | 2000-07-04 |
| 6084288 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 2000-07-04 |
| 6078186 | Force applying probe card and test system for semiconductor wafers | David R. Hembree, James M. Wark | 2000-06-20 |
| 6078100 | Utilization of die repattern layers for die internal connections | Kevin G. Duesman | 2000-06-20 |
| 6077723 | Method for fabricating a multi chip module with alignment member | Salman Akram | 2000-06-20 |
| 6072326 | System for testing semiconductor components | Salman Akram, David R. Hembree, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2000-06-06 |
| 6072324 | Method for testing semiconductor packages using oxide penetrating test contacts | — | 2000-06-06 |
| 6072323 | Temporary package, and method system for testing semiconductor dice having backside electrodes | David R. Hembree, Salman Akram, James M. Wark | 2000-06-06 |