Issued Patents All Time
Showing 651–675 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6003149 | Test method and apparatus for writing a memory array with a reduced number of cycles | Leland R. Nevill, Ray Beffa, Ken Waller, Eugene H. Cloud | 1999-12-14 |
| 6002590 | Flexible trace surface circuit board and method for making flexible trace surface circuit board | Kevin G. Duesman | 1999-12-14 |
| 6002180 | Multi chip module with conductive adhesive layer | Salman Akram, Alan G. Wood | 1999-12-14 |
| 5995378 | Semiconductor device socket, assembly and methods | Larry D. Kinsman, Walter L. Moden | 1999-11-30 |
| 5994915 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 1999-11-30 |
| 5990566 | High density semiconductor package | Salman Akram, Alan G. Wood, Mike Brooks, Eugene H. Cloud | 1999-11-23 |
| 5988480 | Continuous mode solder jet apparatus | — | 1999-11-23 |
| 5986409 | Flat panel display and method of its manufacture | Kevin G. Duesman | 1999-11-16 |
| 5982682 | Self-test circuit for memory integrated circuits | Leland R. Nevill, Ray Beffa, Gene Cloud | 1999-11-09 |
| 5982185 | Direct connect carrier for testing semiconductor dice and method of fabrication | — | 1999-11-09 |
| 5976899 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 1999-11-02 |
| 5973396 | Surface mount IC using silicon vias in an area array format or same size as die array | — | 1999-10-26 |
| 5962921 | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | Derek Gochnour, Salman Akram | 1999-10-05 |
| 5959347 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 1999-09-28 |
| 5958100 | Process of making a glass semiconductor package | Alan G. Wood | 1999-09-28 |
| 5956605 | Use of nitrides for flip-chip encapsulation | Salman Akram | 1999-09-21 |
| 5955877 | Method and apparatus for automatically positioning electronic dice within component packages | Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 1999-09-21 |
| 5952840 | Apparatus for testing semiconductor wafers | Salman Akram, Alan G. Wood, David R. Hembree, James M. Wark, John O. Jacobson | 1999-09-14 |
| 5953216 | Method and apparatus for replacing a defective integrated circuit device | Kevin G. Duesman | 1999-09-14 |
| 5949141 | Laminated film/metal structures | David R. Hembree | 1999-09-07 |
| 5949241 | Method for testing interconnects and semiconductor dice | Salman Akram | 1999-09-07 |
| 5949242 | Method and apparatus for testing unpackaged semiconductor dice | Alan G. Wood, Salman Akram, David R. Hembree | 1999-09-07 |
| 5946553 | Process for manufacturing a semiconductor package with bi-substrate die | Alan G. Wood, Salman Akram | 1999-08-31 |
| 5940277 | Semiconductor device including combed bond pad opening, assemblies and methods | Walter L. Moden, Larry D. Kinsman | 1999-08-17 |
| 5933713 | Method of forming overmolded chip scale package and resulting product | — | 1999-08-03 |