Issued Patents All Time
Showing 676–700 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5931685 | Interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, James M. Wark, Salman Akram, Alan G. Wood | 1999-08-03 |
| 5929647 | Method and apparatus for testing semiconductor dice | Salman Akram, Alan G. Wood, David R. Hembree | 1999-07-27 |
| 5925930 | IC contacts with palladium layer and flexible conductive epoxy bumps | Salman Akram | 1999-07-20 |
| 5915977 | System and interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, James M. Wark, Salman Akram, Alan G. Wood | 1999-06-29 |
| 5915755 | Method for forming an interconnect for testing unpackaged semiconductor dice | Derek Gochnour | 1999-06-29 |
| 5916004 | Photolithographically produced flat panel display surface plate support structure | — | 1999-06-29 |
| 5910640 | Electrical contact assembly for use in a multi-die encapsulation device | Alan G. Wood, Tim J. Corbett | 1999-06-08 |
| 5910921 | Self-test of a memory device | Ray Beffa, William K. Waller, Eugene H. Cloud, Leland R. Nevill | 1999-06-08 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 1999-05-25 |
| 5904546 | Method and apparatus for dicing semiconductor wafers | Alan G. Wood, Salman Akram | 1999-05-18 |
| 5903044 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 1999-05-11 |
| 5898629 | System for stressing a memory integrated circuit die | Ray Beffa, Leland R. Nevill, Eugene H. Cloud, William K. Waller | 1999-04-27 |
| 5898186 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 1999-04-27 |
| 5896036 | Carrier for testing semiconductor dice | Alan G. Wood, David R. Hembree | 1999-04-20 |
| 5894218 | Method and apparatus for automatically positioning electronic dice within component packages | Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 1999-04-13 |
| 5894161 | Interconnect with pressure sensing mechanism for testing semiconductor wafers | Salman Akram | 1999-04-13 |
| 5893765 | Compliant contact integrator | — | 1999-04-13 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | David R. Hembree, Derek Gochnour, Salman Akram, John O. Jacobson, James M. Wark +1 more | 1999-04-13 |
| 5892660 | Single in line memory module adapter | Jerrold L. King | 1999-04-06 |
| 5878485 | Method for fabricating a carrier for testing unpackaged semiconductor dice | Alan G. Wood, David R. Hembree | 1999-03-09 |
| 5859539 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Tim J. Corbett | 1999-01-12 |
| 5852581 | Method of stress testing memory integrated circuits | Ray Beffa, Leland R. Nevill, Eugene H. Cloud, William K. Waller | 1998-12-22 |
| 5851911 | Mask repattern process | — | 1998-12-22 |
| 5851845 | Process for packaging a semiconductor die using dicing and testing | Alan G. Wood | 1998-12-22 |
| D402638 | Temporary package for semiconductor dice | Alan G. Wood, David R. Hembree, Salman Akram | 1998-12-15 |