Issued Patents All Time
Showing 701–725 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5847853 | Modulation and demodulation of light to facilitate transmission of information | — | 1998-12-08 |
| 5844418 | Carrier having interchangeable substrate used for testing of semiconductor dies | Alan G. Wood | 1998-12-01 |
| 5840598 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 1998-11-24 |
| D401567 | Temporary package for semiconductor dice | Alan G. Wood, David R. Hembree, Salman Akram | 1998-11-24 |
| 5834945 | High speed temporary package and interconnect for testing semiconductor dice and method of fabrication | Salman Akram, Alan G. Wood | 1998-11-10 |
| 5825195 | Method and apparatus for testing an unpackaged semiconductor die | David R. Hembree, Alan G. Wood | 1998-10-20 |
| 5815000 | Method for testing semiconductor dice with conventionally sized temporary packages | Alan G. Wood, David R. Hembree, Salman Akram | 1998-09-29 |
| 5801452 | Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member | Salman Akram | 1998-09-01 |
| 5796264 | Apparatus for manufacturing known good semiconductor dice | Alan G. Wood | 1998-08-18 |
| 5796746 | Device and method for testing integrated circuit dice in an integrated circuit module | James M. Wark, Eric S. Nelson, Kevin G. Duesman | 1998-08-18 |
| 5789278 | Method for fabricating chip modules | Salman Akram, Alan G. Wood | 1998-08-04 |
| 5786632 | Semiconductor package | Alan G. Wood, Trung T. Doan, John O. Jacobson | 1998-07-28 |
| 5781022 | Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die | Alan G. Wood, Trung T. Doan, Tim J. Corbett | 1998-07-14 |
| 5776824 | "Method for producing laminated film/metal structures for known good die (""KG"") applications" | David R. Hembree | 1998-07-07 |
| 5767443 | Multi-die encapsulation device | Alan G. Wood, Tim J. Corbett | 1998-06-16 |
| D394844 | Temporary package for semiconductor dice | Alan G. Wood, David R. Hembree, Salman Akram | 1998-06-02 |
| 5756370 | Compliant contact system with alignment structure for testing unpackaged semiconductor dice | Salman Akram | 1998-05-26 |
| 5754486 | Self-test circuit for memory integrated circuits | Leland R. Nevill, Ray Beffa, Gene Cloud | 1998-05-19 |
| 5742169 | Apparatus for testing interconnects for semiconductor dice | Salman Akram | 1998-04-21 |
| 5739050 | Method and apparatus for assembling a semiconductor package for testing | — | 1998-04-14 |
| 5739585 | Single piece package for semiconductor die | Salman Akram, Alan G. Wood | 1998-04-14 |
| 5726580 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Tim J. Corbett | 1998-03-10 |
| 5726075 | Method for fabricating microbump interconnect for bare semiconductor dice | David R. Hembree, Derek Gochnour | 1998-03-10 |
| 5721496 | Method and apparatus for leak checking unpackaged semiconductor dice | Alan G. Wood | 1998-02-24 |
| 5716218 | Process for manufacturing an interconnect for testing a semiconductor die | Salman Akram, Alan G. Wood | 1998-02-10 |