Issued Patents All Time
Showing 726–750 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691649 | Carrier having slide connectors for testing unpackaged semiconductor dice | Salman Akram, Mike Brooks | 1997-11-25 |
| 5686318 | Method of forming a die-to-insert permanent connection | Alan G. Wood | 1997-11-11 |
| 5686317 | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die | Salman Akram, Alan G. Wood | 1997-11-11 |
| 5682065 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 1997-10-28 |
| 5678301 | Method for forming an interconnect for testing unpackaged semiconductor dice | Derek Gochnour | 1997-10-21 |
| 5674785 | Method of producing a single piece package for semiconductor die | Salman Akram, Alan G. Wood | 1997-10-07 |
| 5663654 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Tim J. Corbett | 1997-09-02 |
| 5640762 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 1997-06-24 |
| 5634267 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 1997-06-03 |
| 5607818 | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition | Salman Akram, David R. Hembree | 1997-03-04 |
| 5592736 | Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads | Salman Akram, Alan G. Wood | 1997-01-14 |
| 5593927 | Method for packaging semiconductor dice | Alan G. Wood, Trung T. Doan, John O. Jacobson | 1997-01-14 |
| 5585282 | Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor | Alan G. Wood, Trung T. Doan, Tim J. Corbett | 1996-12-17 |
| 5578526 | Method for forming a multi chip module (MCM) | Salman Akram, Alan G. Wood | 1996-11-26 |
| 5578934 | Method and apparatus for testing unpackaged semiconductor dice | Alan G. Wood, Salman Akram, David R. Hembree | 1996-11-26 |
| 5559444 | Method and apparatus for testing unpackaged semiconductor dice | Salman Akram, David R. Hembree | 1996-09-24 |
| 5541525 | Carrier for testing an unpackaged semiconductor die | Alan G. Wood, David R. Hembree | 1996-07-30 |
| 5523697 | Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof | Malcolm Grief, Gurtej S. Sandhu | 1996-06-04 |
| 5519332 | Carrier for testing an unpackaged semiconductor die | Alan G. Wood, David R. Hembree | 1996-05-21 |
| 5510723 | Diced semiconductor device handler | Robert L. Canella | 1996-04-23 |
| 5495667 | Method for forming contact pins for semiconductor dice and interconnects | Salman Akram, Alan G. Wood | 1996-03-05 |
| 5495179 | Carrier having interchangeable substrate used for testing of semiconductor dies | Alan G. Wood | 1996-02-27 |
| 5487999 | Method for fabricating a penetration limited contact having a rough textured surface | — | 1996-01-30 |
| 5483741 | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice | Salman Akram, Alan G. Wood | 1996-01-16 |
| 5484314 | Micro-pillar fabrication utilizing a stereolithographic printing process | — | 1996-01-16 |