Issued Patents All Time
Showing 751–775 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5483174 | Temporary connection of semiconductor die using optical alignment techniques | David R. Hembree | 1996-01-09 |
| 5440240 | Z-axis interconnect for discrete die burn-in for nonpackaged die | Alan G. Wood, David R. Hembree | 1995-08-08 |
| 5440241 | Method for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced thereby | Jerrold L. King, Jerry M. Brooks, George P. McGill | 1995-08-08 |
| 5424652 | Method and apparatus for testing an unpackaged semiconductor die | David R. Hembree, Alan G. Wood | 1995-06-13 |
| 5419807 | Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability | Salman Akram | 1995-05-30 |
| 5408190 | Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die | Alan G. Wood, David R. Hembree | 1995-04-18 |
| 5367253 | Clamped carrier for testing of semiconductor dies | Alan G. Wood, David R. Hembree | 1994-11-22 |
| RE34794 | Gull-wing zig-zag inline lead package having end-of-package anchoring pins | — | 1994-11-22 |
| 5342807 | Soft bond for semiconductor dies | Larry D. Kinsman, Derek Gochnour, Alan G. Wood | 1994-08-30 |
| 5336649 | Removable adhesives for attachment of semiconductor dies | Larry D. Kinsman, Derek Gochnour, Alan G. Wood | 1994-08-09 |
| 5326428 | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Malcolm Grief, Gurtej S. Sandhu | 1994-07-05 |
| 5304842 | Dissimilar adhesive die attach for semiconductor devices | Rockwell Smith, Walter L. Moden | 1994-04-19 |
| 5286679 | Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer | Ed A. Shrock, Scott Clifford, Jerrold L. King, Walter L. Moden | 1994-02-15 |
| 5256598 | Shrink accommodating lead frame | Alan G. Wood | 1993-10-26 |
| 5249450 | Probehead for ultrasonic forging | Alan G. Wood, David R. Hembree, Larry D. Cromar | 1993-10-05 |
| 5229327 | Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor | — | 1993-07-20 |
| 5218168 | Leads over tab | Steven L. Mitchell | 1993-06-08 |
| 5218229 | Inset die lead frame configuration lead frame for a semiconductor device having means for improved busing and die-lead frame attachment | — | 1993-06-08 |
| 5214657 | Method for fabricating wafer-scale integration wafers and method for utilizing defective wafer-scale integration wafers | Kevin G. Duesman, Ed Heitzeberg | 1993-05-25 |
| 5180974 | Semiconductor testing and shipping system | Steven L. Mitchell | 1993-01-19 |
| 5145099 | Method for combining die attach and lead bond in the assembly of a semiconductor package | Alan G. Wood, George P. McGill | 1992-09-08 |
| 5140405 | Semiconductor assembly utilizing elastomeric single axis conductive interconnect | Jerrold L. King, Jerry M. Brooks, George P. McGill | 1992-08-18 |
| 5128831 | High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias | Angus C. Fox, III | 1992-07-07 |
| 5079618 | Semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies | — | 1992-01-07 |
| 5062565 | Method for combining die attach and wirebond in the assembly of a semiconductor package | Alan G. Wood, George P. McGill | 1991-11-05 |