Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5214657 | Method for fabricating wafer-scale integration wafers and method for utilizing defective wafer-scale integration wafers | Warren M. Farnworth, Kevin G. Duesman | 1993-05-25 |
| 5059899 | Semiconductor dies and wafers and methods for making | Warren Farnworth, Kevin G. Duesman | 1991-10-22 |