Issued Patents All Time
Showing 626–650 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6072236 | Micromachined chip scale package | Salman Akram, David R. Hembree | 2000-06-06 |
| 6068669 | Compliant interconnect for testing a semiconductor die | Salman Akram, Alan G. Wood | 2000-05-30 |
| 6064216 | Apparatus for testing semiconductor wafers | Salman Akram, Alan G. Wood, David R. Hembree, James M. Wark, John O. Jacobson | 2000-05-16 |
| 6064194 | Method and apparatus for automatically positioning electronic dice within component packages | Jennifer L. Folaron, Robert Folaron, David R. Hembree, John O. Jacobson, Jay C. Nelson +1 more | 2000-05-16 |
| 6060894 | Temporary package, method and system for testing semiconductor dice having backside electrodes | David R. Hembree, Salman Akram, James M. Wark | 2000-05-09 |
| 6060893 | Carrier having slide connectors for testing unpackaged semiconductor dice | Salman Akram, Mike Brooks | 2000-05-09 |
| 6060891 | Probe card for semiconductor wafers and method and system for testing wafers | David R. Hembree, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2000-05-09 |
| 6057597 | Semiconductor package with pre-fabricated cover | David R. Hembree, Derek Gochnour, Salman Akram, John O. Jacobson, James M. Wark +1 more | 2000-05-02 |
| 6048753 | Standardized bonding location process and apparatus | Alan G. Wood | 2000-04-11 |
| 6045026 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2000-04-04 |
| 6040702 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Alan G. Wood, Derek Gochnour, Salman Akram | 2000-03-21 |
| 6040239 | Non-oxidizing touch contact interconnect for semiconductor test systems and method of fabrication | Salman Akram | 2000-03-21 |
| 6032264 | Apparatus and method implementing repairs on a memory device | Ray Beffa, William K. Waller, Lee R. Nevill, Eugene H. Cloud | 2000-02-29 |
| 6028365 | Integrated circuit package and method of fabrication | Salman Akram | 2000-02-22 |
| 6025731 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Alan G. Wood, James M. Wark, Derek Gochnour | 2000-02-15 |
| 6025730 | Direct connect interconnect for testing semiconductor dice and wafers | Salman Akram, James M. Wark | 2000-02-15 |
| 6025728 | Semiconductor package with wire bond protective member | David R. Hembree, Salman Akram, Derek Gochnour | 2000-02-15 |
| 6020629 | Stacked semiconductor package and method of fabrication | Alan G. Wood, Mike Brooks | 2000-02-01 |
| 6020624 | Semiconductor package with bi-substrate die | Alan G. Wood, Salman Akram | 2000-02-01 |
| 6018249 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, David R. Hembree | 2000-01-25 |
| 6016060 | Method, apparatus and system for testing bumped semiconductor components | Salman Akram, Alan G. Wood, David R. Hembree | 2000-01-18 |
| 6013948 | Stackable chip scale semiconductor package with mating contacts on opposed surfaces | Salman Akram, Alan G. Wood | 2000-01-11 |
| 6008070 | Wafer level fabrication and assembly of chip scale packages | — | 1999-12-28 |
| 6005290 | Multi chip module having self limiting contact members | Salman Akram, Alan G. Wood | 1999-12-21 |
| 6005288 | Compliant contact system with alignment structure for testing unpackaged semiconductor device | Salman Akram | 1999-12-21 |