Issued Patents All Time
Showing 576–600 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6188232 | Temporary package, system, and method for testing semiconductor dice and chip scale packages | Salman Akram, Alan G. Wood | 2001-02-13 |
| 6180504 | Method for fabricating a semiconductor component with external polymer support layer | Alan G. Wood | 2001-01-30 |
| 6180527 | Method and apparatus for thinning article, and article | Derek Gochnour | 2001-01-30 |
| 6172413 | Chip leads constrained in dielectric media | — | 2001-01-09 |
| 6169329 | Semiconductor devices having interconnections using standardized bonding locations and methods of designing | Alan G. Wood | 2001-01-02 |
| 6168969 | Surface mount IC using silicon vias in an area array format or same size as die array | — | 2001-01-02 |
| 6165817 | Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections | Salman Akram | 2000-12-26 |
| 6159769 | Use of palladium in IC manufacturing | Salman Akram | 2000-12-12 |
| 6150828 | Method and apparatus for automatically positioning electronic dice with component packages | Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2000-11-21 |
| 6150717 | Direct die contact (DDC) semiconductor package | Alan G. Wood, Ford B. Grigg, Salman Akram | 2000-11-21 |
| 6147413 | Mask repattern process | — | 2000-11-14 |
| 6145092 | Apparatus and method implementing repairs on a memory device | Ray Beffa, William K. Waller, Lee R. Nevill, Eugene H. Cloud | 2000-11-07 |
| 6144560 | Semiconductor device including combed bond pad opening, assemblies and methods | Walter L. Moden, Larry D. Kinsman | 2000-11-07 |
| 6136137 | System and method for dicing semiconductor components | Alan G. Wood | 2000-10-24 |
| 6133638 | Die-to-insert permanent connection and method of forming | Alan G. Wood | 2000-10-17 |
| 6130148 | Interconnect for semiconductor components and method of fabrication | Salman Akram | 2000-10-10 |
| 6127195 | Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus | Malcolm Grief, Gurtej S. Sandhu | 2000-10-03 |
| 6124721 | Method of engaging electrically conductive test pads on a semiconductor substrate | Malcolm Grief, Gurtej S. Sandhu | 2000-09-26 |
| 6124634 | Micromachined chip scale package | Salman Akram, David R. Hembree | 2000-09-26 |
| 6124195 | Utilization of die repattern layers for die internal connections | Kevin G. Duesman | 2000-09-26 |
| 6121576 | Method and process of contact to a heat softened solder ball array | David R. Hembree | 2000-09-19 |
| 6119251 | Self-test of a memory device | Eugene H. Cloud, Leland R. Nevill, Ray Beffa | 2000-09-12 |
| 6118179 | Semiconductor component with external contact polymer support member and method of fabrication | Alan G. Wood | 2000-09-12 |
| 6118138 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2000-09-12 |
| 6114240 | Method for fabricating semiconductor components using focused laser beam | Salman Akram, Alan G. Wood | 2000-09-05 |