Issued Patents All Time
Showing 551–575 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6238942 | Method of wire-bonding a repair die in a multi-chip module using a repair solution generated during testing of the module | — | 2001-05-29 |
| 6235554 | Method for fabricating stackable chip scale semiconductor package | Salman Akram, Alan G. Wood | 2001-05-22 |
| 6235551 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2001-05-22 |
| 6232146 | Semiconductor device including combed bond pad opening, assemblies and methods | Walter L. Moden, Larry D. Kinsman | 2001-05-15 |
| 6232243 | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | Derek Gochnour, Salman Akram | 2001-05-15 |
| 6233154 | Single-piece molded module housing | Jerrold L. King | 2001-05-15 |
| 6233185 | Wafer level burn-in of memory integrated circuits | Ray Beffa, Leland R. Nevill, Eugene H. Cloud, William K. Waller | 2001-05-15 |
| 6228677 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2001-05-08 |
| 6229324 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, David R. Hembree | 2001-05-08 |
| 6219908 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 2001-04-24 |
| 6222280 | Test interconnect for semiconductor components having bumped and planar contacts | Salman Akram | 2001-04-24 |
| 6222379 | Conventionally sized temporary package for testing semiconductor dice | Alan G. Wood, David R. Hembree, Salman Akram | 2001-04-24 |
| 6217232 | Method and apparatus for aligning an optic fiber with an opto-electronic device | Kevin G. Duesman | 2001-04-17 |
| 6215183 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2001-04-10 |
| 6215322 | Conventionally sized temporary package for testing semiconductor dice | Alan G. Wood, David R. Hembree, Salman Akram | 2001-04-10 |
| 6210984 | Method and apparatus for automatically positioning electronic dice within component packages | Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2001-04-03 |
| 6211052 | Mask repattern process | — | 2001-04-03 |
| 6210993 | High density semiconductor package and method of fabrication | Salman Akram, Alan G. Wood, Mike Brooks, Eugene H. Cloud | 2001-04-03 |
| 6207548 | Method for fabricating a micromachined chip scale package | Salman Akram, David R. Hembree | 2001-03-27 |
| 6208157 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2001-03-27 |
| 6202292 | Apparatus for removing carrier film from a semiconductor die | Rockwell Smith | 2001-03-20 |
| 6204095 | Method of forming overmolded chip scale package and resulting product | — | 2001-03-20 |
| 6204678 | Direct connect interconnect for testing semiconductor dice and wafers | Salman Akram, James M. Wark | 2001-03-20 |
| 6198636 | Semiconductor device socket, assembly and methods | Larry D. Kinsman, Walter L. Moden | 2001-03-06 |
| 6191474 | Vertically mountable interposer assembly and method | Larry D. Kinsman, Walter L. Moden | 2001-02-20 |