Issued Patents All Time
Showing 501–525 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6333555 | Interconnect for semiconductor components and method of fabrication | Salman Akram | 2001-12-25 |
| 6331736 | Utilization of die repattern layers for die internal connections | Kevin G. Duesman | 2001-12-18 |
| 6329828 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2001-12-11 |
| 6329637 | Method and process of contract to a heat softened solder ball array | David R. Hembree | 2001-12-11 |
| 6329709 | Interconnections for a semiconductor device | Walter L. Moden, Larry D. Kinsman | 2001-12-11 |
| 6329712 | High density flip chip memory arrays | Salman Akram, Alan G. Wood | 2001-12-11 |
| 6329829 | Interconnect and system for making temporary electrical connections to semiconductor components | Salman Akram | 2001-12-11 |
| 6326245 | Method and apparatus for fabricating electronic device | Kevin G. Duesman, Alan G. Wood | 2001-12-04 |
| 6325057 | Complete blade and wafer handling and support system without tape | — | 2001-12-04 |
| 6325058 | Complete blade and wafer handling and support system without tape | — | 2001-12-04 |
| 6325271 | Continuous mode solder jet apparatus | — | 2001-12-04 |
| 6326697 | Hermetically sealed chip scale packages formed by wafer level fabrication and assembly | — | 2001-12-04 |
| 6320397 | Molded plastic carrier for testing semiconductor dice | Alan G. Wood, David R. Hembree | 2001-11-20 |
| 6319354 | System and method for dicing semiconductor components | Alan G. Wood | 2001-11-20 |
| 6319065 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2001-11-20 |
| 6316823 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2001-11-13 |
| 6316839 | Mask repattern process | — | 2001-11-13 |
| 6313651 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Alan G. Wood, Derek Gochnour, Salman Akram | 2001-11-06 |
| 6313658 | Device and method for isolating a short-circuited integrated circuit (IC) from other IC's on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2001-11-06 |
| 6307394 | Test carrier with variable force applying mechanism for testing semiconductor components | Salman Akram, James M. Wark, Derek Gochnour | 2001-10-23 |
| 6304355 | Modulation and demodulation of light to facilitate transmission of information | — | 2001-10-16 |
| 6296171 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2001-10-02 |
| 6297660 | Test carrier with variable force applying mechanism for testing semiconductor components | Salman Akram, James M. Wark, Derek Gochnour | 2001-10-02 |
| 6297542 | Connecting a die in an integrated circuit module | Larry D. Kinsman, Walter L. Moden | 2001-10-02 |
| 6294837 | Semiconductor interconnect having laser machined contacts | Salman Akram, Alan G. Wood | 2001-09-25 |