Issued Patents All Time
Showing 451–475 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, David R. Hembree, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6420681 | Method and process of contact to a heat softened solder ball array | David R. Hembree | 2002-07-16 |
| 6417685 | Test system having alignment member for aligning semiconductor components | Salman Akram, Michael E. Hess, David R. Hembree | 2002-07-09 |
| 6414506 | Interconnect for testing semiconductor dice having raised bond pads | Salman Akram, Alan G. Wood | 2002-07-02 |
| 6414374 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2002-07-02 |
| 6413862 | Use of palladium in IC manufacturing | Salman Akram | 2002-07-02 |
| 6408508 | Method for making flexible trace surface circuit board | Kevin G. Duesman | 2002-06-25 |
| 6410406 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2002-06-25 |
| 6408509 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Walter L. Moden | 2002-06-25 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Mike Hess, David R. Hembree, James M. Wark, John O. Jacobson, Salman Akram | 2002-06-18 |
| 6407451 | Micromachined chip scale package | Salman Akram, David R. Hembree | 2002-06-18 |
| 6404063 | Die-to-insert permanent connection and method of forming | Alan G. Wood | 2002-06-11 |
| 6400008 | Surface mount ic using silicon vias in an area array format or same size as die array | — | 2002-06-04 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Salman Akram, Michael E. Hess, David R. Hembree | 2002-06-04 |
| 6400172 | Semiconductor components having lasered machined conductive vias | Salman Akram, Alan G. Wood | 2002-06-04 |
| 6395566 | Method of wire-bonding a repair die in a multi-chip module using a repair solution generated during testing of the module | — | 2002-05-28 |
| 6396291 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2002-05-28 |
| 6391680 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2002-05-21 |
| 6392429 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Alan G. Wood, Salman Akram | 2002-05-21 |
| 6392426 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Malcolm Grief, Gurtej S. Sandhu | 2002-05-21 |
| 6387714 | Die-to-insert permanent connection and method of forming | Alan G. Wood | 2002-05-14 |
| 6384426 | System for testing semiconductor chip leads constrained in dielectric media | — | 2002-05-07 |
| 6383825 | Method and system for testing semiconductor dice, semiconductor packages and semiconductor wafers | Alan G. Wood | 2002-05-07 |
| 6379983 | Method of wire-bonding a repair die in a multi-chip module using a repair solution generated during testing of the module | — | 2002-04-30 |