Issued Patents All Time
Showing 401–425 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6534342 | Method of manufacturing LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2003-03-18 |
| 6534341 | Methods of wafer level fabrication and assembly of chip scale packages | — | 2003-03-18 |
| 6531764 | Vertically mountable semiconductor device, assembly, and methods | Larry D. Kinsman, Walter L. Moden | 2003-03-11 |
| 6531345 | Method and apparatus for fabricating electronic device | Kevin G. Duesman, Alan G. Wood | 2003-03-11 |
| 6529027 | Interposer and methods for fabricating same | Salman Akram, Alan G. Wood | 2003-03-04 |
| 6529026 | Method for fabricating an interconnect for making temporary electrical connections to semiconductor components | Salman Akram | 2003-03-04 |
| 6528894 | Use of nitrides for flip-chip encapsulation | Salman Akram | 2003-03-04 |
| 6527041 | Methods and apparatus for forming solder balls | — | 2003-03-04 |
| 6524346 | Stereolithographic method for applying materials to electronic component substrates and resulting structures | — | 2003-02-25 |
| 6523736 | Methods and apparatus for forming solder balls | — | 2003-02-25 |
| 6519658 | Memory unit and method of assembling a computer | Alan G. Wood | 2003-02-11 |
| 6515325 | Nanotube semiconductor devices and methods for making the same | Kevin G. Duesman | 2003-02-04 |
| 6514798 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2003-02-04 |
| 6514787 | Opto-electric mounting apparatus | Kevin G. Duesman | 2003-02-04 |
| 6511863 | Method and apparatus for a semiconductor package for vertical surface mounting | Larry D. Kinsman, Walter L. Moden | 2003-01-28 |
| 6512290 | Vertically mountable and alignable semiconductor device, assembly, and methods | Larry D. Kinsman, Walter L. Moden | 2003-01-28 |
| 6509647 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2003-01-21 |
| 6505395 | Apparatus and method for removing carrier tape from a singulated die | Rockwell Smith | 2003-01-14 |
| 6501165 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Alan G. Wood, Mike Brooks | 2002-12-31 |
| 6492187 | Method for automatically positioning electronic die within component packages | Alan G. Wood, John O. Jacobson, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6491574 | Complete blade and wafer handling and support system without tape | — | 2002-12-10 |
| 6492738 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2002-12-10 |
| 6492728 | Vertical surface mount assembly | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2002-12-10 |
| 6489183 | Method of manufacturing a taped semiconductor device | — | 2002-12-03 |
| 6482576 | Surface smoothing of stereolithographically formed 3-D objects | Kevin G. Duesman | 2002-11-19 |