Issued Patents All Time
Showing 376–400 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6599776 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2003-07-29 |
| 6600171 | Semiconductor component and system for fabricating contacts on semiconductor components | Alan G. Wood, Douglas Kelly | 2003-07-29 |
| 6597066 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 2003-07-22 |
| 6593171 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2003-07-15 |
| 6588645 | Continuous mode solder jet apparatus | — | 2003-07-08 |
| 6578262 | Heat transfer material for an improved die edge contacting socket | — | 2003-06-17 |
| 6576494 | Recessed encapsulated microelectronic devices and methods for formation | — | 2003-06-10 |
| 6573740 | Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate | Malcolm Grief, Gurtej S. Sandhu | 2003-06-03 |
| 6570771 | Single-piece molded module housing | Jerrold L. King | 2003-05-27 |
| 6562278 | Methods of fabricating housing structures and micromachines incorporating such structures | Kevin G. Duesman | 2003-05-13 |
| 6562637 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2003-05-13 |
| 6558979 | Use of palladium in IC manufacturing with conductive polymer bump | Salman Akram | 2003-05-06 |
| 6555460 | Methods for mask repattern process | — | 2003-04-29 |
| 6555400 | Method for substrate mapping | Derek Gochnour | 2003-04-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2003-04-22 |
| 6549821 | Stereolithographic method and apparatus for packaging electronic components and resulting structures | Mark S. Johnson | 2003-04-15 |
| 6548392 | Methods of a high density flip chip memory arrays | Salman Akram, Alan G. Wood | 2003-04-15 |
| 6544902 | Energy beam patterning of protective layers for semiconductor devices | — | 2003-04-08 |
| 6544465 | Method for forming three dimensional structures from liquid with improved surface finish | Kevin G. Duesman | 2003-04-08 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2003-04-08 |
| 6541850 | Utilization of die active surfaces for laterally extending die internal and external connections | Kevin G. Duesman | 2003-04-01 |
| 6538334 | High density flip chip memory arrays | Salman Akram, Alan G. Wood | 2003-03-25 |
| 6537482 | Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography | — | 2003-03-25 |
| 6535393 | Electrical device allowing for increased device densities | Salman Akram, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2003-03-18 |
| 6534785 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2003-03-18 |