Issued Patents All Time
Showing 326–350 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6730999 | Clip chip carrier | Derek Gochnour, Alan G. Wood | 2004-05-04 |
| 6729027 | Method of forming recessed socket contacts | Salman Akram | 2004-05-04 |
| 6725536 | Methods for the fabrication of electrical connectors | Salman Akram, David R. Hembree | 2004-04-27 |
| 6715018 | Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer | Alan G. Wood | 2004-03-30 |
| 6713788 | Opto-electric mounting apparatus | Kevin G. Duesman | 2004-03-30 |
| 6710612 | CSP BGA test socket with insert and method | Derek Gochnour, David R. Hembree | 2004-03-23 |
| 6710442 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices | Joseph T. Lindgren, William M. Hiatt, Nishant Sinha | 2004-03-23 |
| 6710284 | Laser marking techniques for bare semiconductor die | Alan G. Wood | 2004-03-23 |
| 6709893 | Interconnections for a semiconductor device and method for forming same | Walter L. Moden, Larry D. Kinsman | 2004-03-23 |
| 6709795 | Stereolithographically packaged, in-process semiconductor die | Kevin G. Duesman | 2004-03-23 |
| 6708399 | Method for fabricating a test interconnect for bumped semiconductor components | Salman Akram | 2004-03-23 |
| 6705513 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames | Alan G. Wood | 2004-03-16 |
| 6687989 | Method for fabricating interconnect having support members for preventing component flexure | Mike Hess, David R. Hembree, James M. Wark, John O. Jacobson, Salman Akram | 2004-02-10 |
| 6686758 | Engagement probe and apparatuses configured to engage a conductive pad | Malcolm Grief, Gurtej S. Sandhu | 2004-02-03 |
| 6686268 | Method of forming overmolded chip scale package and resulting product | — | 2004-02-03 |
| 6684493 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Walter L. Moden | 2004-02-03 |
| 6681480 | Method and apparatus for installing a circuit device | Larry D. Kinsman, Mike Brooks, Walter L. Moden, Terry R. Lee | 2004-01-27 |
| 6680458 | Laser marking techniques for bare semiconductor die | — | 2004-01-20 |
| 6680213 | Method and system for fabricating contacts on semiconductor components | Alan G. Wood, Douglas Kelly | 2004-01-20 |
| 6673707 | Method of forming semiconductor device utilizing die active surfaces for laterally extending die internal and external connections | Kevin G. Duesman | 2004-01-06 |
| 6673649 | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages | William M. Hiatt | 2004-01-06 |
| 6670819 | Methods of engaging electrically conductive pads on a semiconductor substrate | Malcolm Grief, Gurtej S. Sandhu | 2003-12-30 |
| 6664632 | Utilization of die active surfaces for laterally extending die internal and external connections | Kevin G. Duesman | 2003-12-16 |
| 6658718 | Method for removing carrier film from a singulated die | Rockwell Smith | 2003-12-09 |
| 6662243 | Memory unit, a method of assembling a memory unit, a method of reconfiguring a system, and a memory device | Alan G. Wood | 2003-12-09 |