Issued Patents All Time
Showing 351–375 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656754 | Method of forming a semiconductor chip carrier | Derek Gochnour, Alan G. Wood | 2003-12-02 |
| 6657450 | Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes | Malcolm Grief, Gurtej S. Sandhu | 2003-12-02 |
| 6653721 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2003-11-25 |
| 6648654 | Electrical connector | Salman Akram, David R. Hembree | 2003-11-18 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2003-11-04 |
| 6637638 | System for fabricating solder bumps on semiconductor components | Ford B. Grigg | 2003-10-28 |
| 6639416 | Method and apparatus for testing semiconductor dice | Salman Akram, Alan G. Wood, David R. Hembree | 2003-10-28 |
| 6634098 | Methods for assembling, modifying and manufacturing a vertical surface mount package | Larry D. Kinsman, Walter L. Moden | 2003-10-21 |
| 6636068 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2003-10-21 |
| 6634100 | Interposer and methods for fabricating same | Salman Akram, Alan G. Wood | 2003-10-21 |
| 6632343 | Method and apparatus for electrolytic plating of surface metals | Kevin G. Duesman | 2003-10-14 |
| 6630365 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Alan G. Wood | 2003-10-07 |
| 6630836 | CSP BGA test socket with insert | Derek Gochnour, David R. Hembree | 2003-10-07 |
| 6628128 | CSP BGA test socket with insert and method | Derek Gochnour, David R. Hembree | 2003-09-30 |
| 6622773 | Method and apparatus for forming solder balls | — | 2003-09-23 |
| 6619532 | Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2003-09-16 |
| 6620731 | Method for fabricating semiconductor components and interconnects with contacts on opposing sides | Alan G. Wood, David R. Hembree | 2003-09-16 |
| 6614104 | Stackable semiconductor package having conductive layer and insulating layers | Alan G. Wood, Mike Brooks | 2003-09-02 |
| 6614249 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Malcolm Grief, Gurtej S. Sandhu | 2003-09-02 |
| 6614003 | Method and process of contact to a heat softened solder ball array | David R. Hembree | 2003-09-02 |
| 6612872 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2003-09-02 |
| 6611058 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2003-08-26 |
| 6607689 | Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length | — | 2003-08-19 |
| 6605956 | Device and method for testing integrated circuit dice in an integrated circuit module | James M. Wark, Eric S. Nelson, Kevin G. Duesman | 2003-08-12 |
| 6599776 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Salman Akram, Alan G. Wood | 2003-07-29 |