Issued Patents All Time
Showing 301–325 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787396 | Method of manufacturing LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2004-09-07 |
| 6787394 | Methods of wafer level fabrication and assembly of chip scale packages | — | 2004-09-07 |
| 6784544 | Semiconductor component having conductors with wire bondable metalization layers | — | 2004-08-31 |
| 6781848 | Single-piece molded module housing | Jerrold L. King | 2004-08-24 |
| 6780669 | Method of forming overmolded chip scale package and resulting product | — | 2004-08-24 |
| 6777261 | Method and apparatus for a semiconductor package for vertical surface mounting | Larry D. Kinsman, Walter L. Moden | 2004-08-17 |
| 6773957 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Alan G. Wood | 2004-08-10 |
| 6770514 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2004-08-03 |
| 6768209 | UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLING MICROELECTRONIC DEVICES | Tongbi Jiang, Curtis Hollingshead | 2004-07-27 |
| 6767817 | Asymmetric plating | Joseph T. Lindgren | 2004-07-27 |
| 6765803 | Semiconductor device socket | Larry D. Kinsman, Walter L. Moden | 2004-07-20 |
| 6763578 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 2004-07-20 |
| 6760970 | Method for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2004-07-13 |
| 6758696 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2004-07-06 |
| 6757972 | Method of forming socket contacts | — | 2004-07-06 |
| 6756253 | Method for fabricating a semiconductor component with external contact polymer support layer | Alan G. Wood | 2004-06-29 |
| 6751859 | Method for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2004-06-22 |
| 6751853 | Apparatus and system for removing carrier film from a singulated die | Rockwell Smith | 2004-06-22 |
| 6750548 | Mask repattern process | — | 2004-06-15 |
| 6744067 | Wafer-level testing apparatus and method | Steven M. McDonald | 2004-06-01 |
| 6740960 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Alan G. Wood, Mike Brooks | 2004-05-25 |
| 6740476 | Surface smoothing of stereolithographically formed 3-D objects | Kevin G. Duesman | 2004-05-25 |
| 6735860 | Heat transfer material for an improved die edge contacting socket | — | 2004-05-18 |
| 6735855 | Methods for electrical connector | Salman Akram, David R. Hembree | 2004-05-18 |
| 6734529 | Vertically mountable interposer and assembly | Larry D. Kinsman, Walter L. Moden | 2004-05-11 |