Issued Patents All Time
Showing 426–450 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6478627 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2002-11-12 |
| 6477662 | Apparatus and method implementing repairs on a memory device | Ray Beffa, William K. Waller, Lee R. Nevill, Eugene H. Cloud | 2002-11-05 |
| 6469537 | System for testing semiconductor wafers having interconnect with pressure sensing mechanism | Salman Akram | 2002-10-22 |
| 6465877 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Alan G. Wood, Mike Brooks | 2002-10-15 |
| 6462571 | Engagement probes | Malcolm Grief, Gurtej S. Sandhu | 2002-10-08 |
| 6461881 | Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures | Alan G. Wood | 2002-10-08 |
| 6455351 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Walter L. Moden, Terry R. Lee | 2002-09-24 |
| 6453550 | Method for forming modular sockets using flexible interconnects and resulting structures | David J. Corisis, Salman Akram | 2002-09-24 |
| 6451624 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Alan G. Wood, Mike Brooks | 2002-09-17 |
| 6452415 | Device and method for isolating a short-circuited integrated circuit (IC) from other ICs on a semiconductor wafer | William K. Waller, Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2002-09-17 |
| 6453377 | Computer including optical interconnect, memory unit, and method of assembling a computer | Alan G. Wood | 2002-09-17 |
| 6446334 | Heat transfer material for an improved die edge contacting socket | — | 2002-09-10 |
| 6443350 | Continuous mode solder jet apparatus | — | 2002-09-03 |
| 6442044 | Semiconductor device socket, assembly and methods | Larry D. Kinsman, Walter L. Moden | 2002-08-27 |
| 6441628 | CSP BGA test socket with insert and method | Derek Gochnour, David R. Hembree | 2002-08-27 |
| 6437451 | Test interconnect for semiconductor components having bumped and planar contacts | Salman Akram | 2002-08-20 |
| 6437435 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Walter L. Moden | 2002-08-20 |
| 6437591 | Test interconnect for bumped semiconductor components and method of fabrication | Salman Akram | 2002-08-20 |
| 6432752 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2002-08-13 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2002-08-06 |
| 6426562 | Mask repattern process | — | 2002-07-30 |
| 6426639 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2002-07-30 |
| 6424168 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2002-07-23 |
| 6420890 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2002-07-16 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, David R. Hembree, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |