Issued Patents All Time
Showing 526–550 of 778 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6295209 | Semiconductor device including combed bond pad opening, assemblies and methods | Walter L. Moden, Larry D. Kinsman | 2001-09-25 |
| 6292009 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2001-09-18 |
| 6291894 | Method and apparatus for a semiconductor package for vertical surface mounting | Larry D. Kinsman, Walter L. Moden | 2001-09-18 |
| 6287942 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 2001-09-11 |
| 6284573 | Wafer level fabrication and assembly of chip scale packages | — | 2001-09-04 |
| 6285203 | Test system having alignment member for aligning semiconductor components | Salman Akram, Michael E. Hess, David R. Hembree | 2001-09-04 |
| 6285204 | Method for testing semiconductor packages using oxide penetrating test contacts | — | 2001-09-04 |
| 6285201 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2001-09-04 |
| 6278286 | Interconnect and system for making temporary electrical connections to semiconductor components | Salman Akram | 2001-08-21 |
| 6275052 | Probe card and testing method for semiconductor wafers | David R. Hembree, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2001-08-14 |
| 6271056 | Stacked semiconductor package and method of fabrication | Alan G. Wood, Mike Brooks | 2001-08-07 |
| 6268655 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2001-07-31 |
| 6265773 | Vertically mountable and alignable semiconductor device, assembly, and methods | Larry D. Kinsman, Walter L. Moden | 2001-07-24 |
| 6265245 | Compliant interconnect for testing a semiconductor die | Salman Akram, Alan G. Wood | 2001-07-24 |
| 6261854 | Interconnect with pressure sensing mechanism for testing semiconductor wafers | Salman Akram | 2001-07-17 |
| 6259036 | Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps | — | 2001-07-10 |
| 6258609 | Method and system for making known good semiconductor dice | Alan G. Wood | 2001-07-10 |
| 6255840 | Semiconductor package with wire bond protective member | David R. Hembree, Salman Akram, Derek Gochnour | 2001-07-03 |
| 6255833 | Method for testing semiconductor dice and chip scale packages | Salman Akram, Alan G. Wood, David R. Hembree | 2001-07-03 |
| 6252302 | Heat transfer material for an improved die edge contacting socket | — | 2001-06-26 |
| 6248611 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2001-06-19 |
| 6246245 | Probe card, test method and test system for semiconductor wafers | Salman Akram, C. Patrick Doherty, David R. Hembree | 2001-06-12 |
| 6242103 | Method for producing laminated film/metal structures | David R. Hembree | 2001-06-05 |
| 6240535 | Device and method for testing integrated circuit dice in an integrated circuit module | James M. Wark, Eric S. Nelson, Kevin G. Duesman | 2001-05-29 |
| 6239590 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, David R. Hembree, Salman Akram, James M. Wark, John O. Jacobson | 2001-05-29 |