Issued Patents All Time
Showing 151–175 of 673 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-27 |
| 11532586 | Connecting techniques for stacked substrates | Hsiang-Jen Tseng, Ting-Wei Chiang, Li-Chun Tien | 2022-12-20 |
| 11527419 | Photonic integrated package and method forming same | Chen-Hua Yu, An-Jhih Su | 2022-12-13 |
| 11508338 | Register spill/fill using shared local memory space | Joydeep Ray, Altug Koker, Balaji Vembu, Murali Ramadoss, Guei-Yuan Lueh +7 more | 2022-11-22 |
| 11510236 | Method and apparatus of requesting resource for sidelink retransmission in a wireless communication system | Ming-Che Li, Li-Chih Tseng, Li-Te Pan | 2022-11-22 |
| 11487091 | Photographing lens assembly, imaging apparatus and electronic device | Chun-Che Hsueh, Chun-Yen Chen | 2022-11-01 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11467321 | Imaging lens assembly, imaging apparatus and electronic device | Po-Lun Hsu | 2022-10-11 |
| 11469215 | Chip package structure with molding layer and method for forming the same | An-Jhih Su | 2022-10-11 |
| 11460678 | Photographing optical lens assembly, image capturing unit and electronic device | Kuo-Jui WANG, Cheng-Chen Lin | 2022-10-04 |
| 11462507 | Bonding through multi-shot laser reflow | Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2022-10-04 |
| 11463184 | Interference determining method and network device | Quanzhong Gao, Kai Xu, Liwen Zhang, Shuqin Xiao | 2022-10-04 |
| 11456783 | EIRP control method, communications apparatus, and communications system | Xiaojun Zheng, Jiang Guo, Qiang Zhu, Chunlin XUE | 2022-09-27 |
| 11442256 | Imaging optical lens assembly, imaging apparatus and electronic device | Hsiang-Chi Tang | 2022-09-13 |
| 11437384 | Semiconductor memory device and method for manufacturing the same | Jr-Chiuan Wang, Rou-Wei Wang | 2022-09-06 |
| 11432372 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Chien-Wei Lee, Chung-Shi Liu | 2022-08-30 |
| 11415780 | Imaging optical system, image capturing device and mobile terminal | Dung-Yi Hsieh, Chun-Che Hsueh | 2022-08-16 |
| 11410956 | Chip package structure with bump | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen | 2022-08-09 |
| 11394400 | Wireless communication data processing method and apparatus for reducing bit error rate | Jun Chen, Yong Xie, Jie Jin, Yinggang Du, Guijie Wang +8 more | 2022-07-19 |
| 11391927 | Optical lens assembly, image capturing apparatus and electronic device | — | 2022-07-19 |
| 11391923 | Optical photographing lens assembly, image capturing device and electronic device | — | 2022-07-19 |
| 11391919 | Imaging lens assembly, image capturing unit and electronic device | Cheng-Yuan Liao | 2022-07-19 |
| 11388733 | Method and apparatus for handling sidelink feedback collision in a wireless communication system | Chun-Wei Huang, Li-Chih Tseng, Ming-Che Li, Li-Te Pan | 2022-07-12 |
| 11372204 | Imaging optical lens assembly, image capturing unit and electronic device | Hung-Shuo CHEN, Syuan Ruei LAI, Kuo-Jui WANG, Po-Lun Hsu | 2022-06-28 |