Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336274 | Self-aligned method for vertical recess for 3D device integration | Jeffrey Smith, Daniel Chanemougame, Lars Liebmann, Paul Gutwin, Kandabara Tapily +1 more | 2025-06-17 |
| 12272558 | Selective and isotropic etch of silicon over silicon-germanium alloys and dielectrics; via new chemistry and surface modification | Matthew Flaugh, Jonathan Hollin, Pingshan Luan, Hamed Hajibabaeinajafabadi, Yu-Hao Tsai +1 more | 2025-04-08 |
| 12261053 | Substrate processing with selective etching | Ivo Otto, IV | 2025-03-25 |
| 12261054 | Substrate processing with material modification and removal | Ivo Otto, IV | 2025-03-25 |
| 11715643 | Gas phase etch with controllable etch selectivity of metals | Daisuke Ito, Matthew Flaugh, Yusuke Muraki, Aelan Mosden | 2023-08-01 |
| 11631671 | 3D complementary metal oxide semiconductor (CMOS) device and method of forming the same | H. Jim Fulford, Anton J. deVilliers, Mark I. Gardner, Daniel Chanemougame, Jeffrey Smith +1 more | 2023-04-18 |
| 11557479 | Methods for EUV inverse patterning in processing of microelectronic workpieces | Eric Chih-Fang Liu, Akiteru Ko, Toshiharu Wada | 2023-01-17 |
| 11538691 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Nihar Mohanty, Angelique Raley, Aelan Mosden, Scott Lefevre | 2022-12-27 |
| 11444082 | Semiconductor apparatus having stacked gates and method of manufacture thereof | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Gerrit J. Leusink | 2022-09-13 |
| 11424123 | Forming a semiconductor feature using atomic layer etch | Eric Chih-Fang Liu, Akiteru Ko, Angelique Raley, Henan Zhang, Shan Hu | 2022-08-23 |
| 11380554 | Gas phase etching system and method | Nihar Mohanty, Angelique Raley, Aelan Mosden, Scott Lefevre | 2022-07-05 |
| 11322401 | Reverse contact and silicide process for three-dimensional semiconductor devices | Jeffrey Smith, Lars Liebmann, Daniel Chanemougame, Hiroki Niimi, Kandabara Tapily +2 more | 2022-05-03 |
| 11322350 | Non-plasma etch of titanium-containing material layers with tunable selectivity to alternate metals and dielectrics | Daisuke Ito, Shinji Irie, Aelan Mosden | 2022-05-03 |
| 11264274 | Reverse contact and silicide process for three-dimensional logic devices | Jeffrey Smith, Hiroaki Niimi, Jodi Grzeskowiak, Daniel Chanemougame, Lars Liebmann +2 more | 2022-03-01 |
| 10991626 | Method for controlling transistor delay of nanowire or nanosheet transistor devices | Jeffrey Smith, Anton J. deVilliers | 2021-04-27 |
| 10971372 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Nihar Mohanty, Angelique Raley, Aelan Mosden, Scott Lefevre | 2021-04-06 |
| 10923356 | Gas phase etch with controllable etch selectivity of silicon-germanium alloys | Masashi Matsumoto, Daisuke Ito, Yusuke Muraki, Aelan Mosden | 2021-02-16 |
| 10833078 | Semiconductor apparatus having stacked gates and method of manufacture thereof | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Gerrit J. Leusink | 2020-11-10 |
| 10714391 | Method for controlling transistor delay of nanowire or nanosheet transistor devices | Jeffrey Smith, Anton J. deVilliers | 2020-07-14 |
| 10685887 | Method for incorporating multiple channel materials in a complimentary field effective transistor (CFET) device | Jeffrey Smith | 2020-06-16 |
| 10580660 | Gas phase etching system and method | Nihar Mohanty, Angelique Raley, Aelan Mosden, Scott Lefevre | 2020-03-03 |
| 10573564 | Method for fabricating NFET and PFET nanowire devices | Aelan Mosden, Cheryl Pereira | 2020-02-25 |
| 10378105 | Selective deposition with surface treatment | Kai-Hung Yu, Kandabara Tapily, Takahiro Hakamata, Gerrit J. Leusink | 2019-08-13 |
| 9997598 | Three-dimensional semiconductor device and method of fabrication | Jeffrey Smith, Anton J. deVilliers, Nihar Mohanty, Kandabara Tapily | 2018-06-12 |
| 9984890 | Isotropic silicon and silicon-germanium etching with tunable selectivity | Kandabara Tapily, Aelan Mosden | 2018-05-29 |