Issued Patents All Time
Showing 25 most recent of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224252 | Magnetic core inductors in interposer | Krishna Bharath, William J. Lambert, Haifa Hariri, Siddharth Kulasekaran, Anne Augustine | 2025-02-11 |
| 12094831 | High density interconnect device and method | Mihir K. Roy | 2024-09-17 |
| 12094827 | Size and efficiency of dies | Jonathan Rosenfeld | 2024-09-17 |
| 12051651 | Size and efficiency of dies | Jonathan Rosenfeld | 2024-07-30 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11961804 | Size and efficiency of dies | Jonathan Rosenfeld | 2024-04-16 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11715695 | Size and efficiency of dies | Jonathan Rosenfeld | 2023-08-01 |
| 11688729 | Integrated thin film capacitors on a glass core substrate | Adel A. Elsherbini, Krishna Bharath | 2023-06-27 |
| 11664320 | High density interconnect device and method | Mihir K. Roy | 2023-05-30 |
| 11608564 | Helical plated through-hole package inductor | William J. Lambert, Mihir K. Roy, Yikang Deng | 2023-03-21 |
| 11527489 | Apparatus and system with package stiffening magnetic inductor core and methods of making the same | Michael J. Hill, Beomseok Choi, Digvijay A. Raorane | 2022-12-13 |
| 11437346 | Package structure having substrate thermal vent structures for inductor cooling | Michael J. Hill, Leigh E. Wojewoda, Siddharth Kulasekaran | 2022-09-06 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2022-05-10 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11158578 | High density interconnect device and method | Mihir K. Roy | 2021-10-26 |
| 10998120 | Method of making an inductor | William J. Lambert, Mihir K. Roy, Yikang Deng | 2021-05-04 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2021-04-06 |
| 10886228 | Improving size and efficiency of dies | Jonathan Rosenfeld | 2021-01-05 |
| 10847467 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Debendra Mallik, Jianyong Xie | 2020-11-24 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10734282 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mark S. Hlad | 2020-08-04 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2020-05-12 |
| 10522455 | Integrated circuit package substrate | Dustin P. Wood, Debendra Mallik | 2019-12-31 |
| 10490503 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Debendra Mallik, Jianyong Xie | 2019-11-26 |