LD

Lawrence D. David

IBM: 22 patents #4,909 of 70,183Top 7%
CG Celanese Gmbh: 8 patents #13 of 478Top 3%
CH Chemfab: 2 patents #5 of 16Top 35%
DU Duke University: 2 patents #648 of 2,315Top 30%
WARF: 1 patents #1,912 of 4,123Top 50%
Overall (All Time): #91,970 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 25 most recent of 36 patents

Patent #TitleCo-InventorsDate
12252750 Compositions and methods for measuring bacterial growth Rachael Bloom 2025-03-18
11313000 Compositions and methods for measuring bacterial growth Rachael Bloom 2022-04-26
6691618 Chemical imaging of a lithographic printing plate Albert S. Deutsch, David B. West 2004-02-17
6417280 Fluoropolymeric composition John A. Effenberger, Christopher M. Comeaux, Timothy P. Pollock, Katherine M. Sahlin, Laura A. Socha +2 more 2002-07-09
6358439 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Farid Youssif Aoude, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more 2002-03-19
6355565 Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers Paul M. Feeney, Timothy C. Krywanczyk, Matthew T. Tiersch, Eric J. White 2002-03-12
6294105 Chemical mechanical polishing slurry and method for polishing metal/oxide layers Paul M. Feeney, Timothy C. Krywanczyk, Matthew T. Tiersch, Eric J. White 2001-09-25
6284151 Chemical mechanical polishing slurry for tungsten Timothy C. Krywanczyk 2001-09-04
6239223 Fluoropolymeric composition John A. Effenberger, Christopher M. Comeaux, Timothy P. Pollock, Katherine M. Sahlin, Laura A. Socha +2 more 2001-05-29
6221269 Method of etching molybdenum metal from substrates Krishna G. Sachdev, Umar M. Ahmad, Hsing H. Chen, Charles H. Perry, Donald R. Wall 2001-04-24
6130170 Process improvements for titanium-tungsten etching in the presence of electroplated C4's Lisa A. Fanti 2000-10-10
6124041 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Farid Youssif Aoude, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more 2000-09-26
6015505 Process improvements for titanium-tungsten etching in the presence of electroplated C4's Lisa A. Fanti 2000-01-18
5925443 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias Farid Youssif Aoude, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more 1999-07-20
5525761 Copper-based paste containing refractory metal additions for densification control Shaji Farooq, Anthony Mastreani, Srinivasa S. N. Reddy, Rao V. Vallabhaneni 1996-06-11
5518131 Etching molydbenum with ferric sulfate and ferric ammonium sulfate Hsing H. Chen, Derek B. Harris 1996-05-21
5512711 Copper-based paste containing refractory metal additions for densification control Shaji Farooq, Anthony Mastreani, Srinivasa S. N. Reddy, Rao V. Vallabhaneni 1996-04-30
5277725 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1994-01-11
5213704 Process for making a compliant thermally conductive compound Herbert R. Anderson, Jr., Richard B. Booth, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs 1993-05-25
5135595 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1992-08-04
5094769 Compliant thermally conductive compound Herbert R. Anderson, Jr., Richard B. Booth, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs 1992-03-10
4995942 Effective near neutral pH etching solution for molybdenum or tungsten 1991-02-26
4954142 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor Jeffrey Carr, William L. Guthrie, Frank B. Kaufman, William J. Patrick, Kenneth P. Rodbell +2 more 1990-09-04
4898842 Organometallic-derived cordierite and other compounds comprising oxides of silicon 1990-02-06
4798701 Method of synthesizing amorphous group IIIA-group VA compounds 1989-01-17