Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11280019 | Non-permeable substrate carrier for electroplating | Emmanuel Chua Abas, Chen-An Chen, Kalyana Bhargava Ganti, Edmundo Anida Divino, Jake Randal G. Ermita +2 more | 2022-03-22 |
| RE46088 | Maintainable substrate carrier for electroplating | Chen-An Chen, Emmanuel Chua Abas, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco Capulong +1 more | 2016-08-02 |
| 9222193 | Non-permeable substrate carrier for electroplating | Emmanuel Chua Abas, Chen-An Chen, Kalyana Bhargava Ganti, Edmundo Anida Divino, Jake Randal G. Ermita +2 more | 2015-12-29 |
| 8317987 | Non-permeable substrate carrier for electroplating | Emmanuel Chua Abas, Chen-An Chen, Kalyana Bhargava Ganti | 2012-11-27 |
| 8221601 | Maintainable substrate carrier for electroplating | Chen-An Chen, Emmanuel Chua Abas, Edmundo Anida Divino, Jake Randal G. Ermita, Jose Francisco Capulong +1 more | 2012-07-17 |
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Brian Sy-Yuan Shieh, Gerald Yin, Jennifer Y. Sun, Senh Thach +2 more | 2005-09-27 |
| 6829056 | Monitoring dimensions of features at different locations in the processing of substrates | Michael Barnes, John D. Holland, II, Hongqing Shan, Bryan Pu, Mohit Jain +5 more | 2004-12-07 |
| 6641697 | Substrate processing using a member comprising an oxide of a group IIIB metal | Nianci Han, Hong Shih, Jie Yuan, Danny Lu | 2003-11-04 |
| 6635577 | Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing system | John M. Yamartino, Peter K. Loewengardt, Kenlin Huang | 2003-10-21 |
| 6620289 | Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing system | Chun Yan, Yan Ye | 2003-09-16 |
| 6592707 | Corrosion-resistant protective coating for an apparatus and method for processing a substrate | Hong Shih, Nianci Han, Jie Yuan, Joe Sommers, Paul Vollmer +1 more | 2003-07-15 |
| 6569775 | Method for enhancing plasma processing performance | Peter Loewenhardt, John M. Yamartino, Hui Chen | 2003-05-27 |
| 6547978 | Method of heating a semiconductor substrate | Yan Ye, Allen Zhao, Xiancan Deng, Chang-Lin Hsieh | 2003-04-15 |
| 6547977 | Method for etching low k dielectrics | Chun Yan, Gary Hsueh, Yan Ye | 2003-04-15 |
| 6534416 | Control of patterned etching in semiconductor features | Yan Ye, Allen Zhao, Xiancan Deng | 2003-03-18 |
| 6489247 | Copper etch using HCl and HBR chemistry | Yan Ye, Allen Zhao, Xiancan Deng | 2002-12-03 |
| 6488862 | Etched patterned copper features free from etch process residue | Yan Ye, Gerald Yin | 2002-12-03 |
| 6466881 | Method for monitoring the quality of a protective coating in a reactor chamber | Hong Shih, Joe Sommers | 2002-10-15 |
| 6458516 | Method of etching dielectric layers using a removable hardmask | Yan Ye, Pavel Ionov, Allen Zhao, Peter Hsieh, Chun Yan +1 more | 2002-10-01 |
| 6413389 | Method for recovering metal from etch by-products | Hong Shih, Danny Lu, Nianci Han, Li Xu | 2002-07-02 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Zheng Xu, Liang Chen, Roderick C. Mosely +3 more | 2002-04-16 |
| 6352611 | Ceramic composition for an apparatus and method for processing a substrate | Nianci Han, Hong Shih, Jie Yuan, Danny Lu | 2002-03-05 |
| 6352049 | Plasma assisted processing chamber with separate control of species density | Gerald Yin, Arnold Kolandenko, Hong Ching Shan, Peter Loewenhardt, Chii Guang Lee +9 more | 2002-03-05 |
| 6331380 | Method of pattern etching a low K dielectric layer | Yan Ye, Pavel Ionov, Allen Zhao, Peter Hsieh, Chun Yan +1 more | 2001-12-18 |
| 6296780 | System and method for etching organic anti-reflective coating from a substrate | Chun Yan, Yan Ye | 2001-10-02 |