Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322290 | Techniques for an inductor at a first level interface | Cheng Xu, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2022-05-03 |
| 11272619 | Apparatus with embedded fine line space in a cavity, and a method for forming the same | Kristof Darmawikarta, Robert Alan May, Ji-Yong Park, Maroun D. Moussallem, Amruthavalli Pallavi Alur +2 more | 2022-03-08 |
| 11246218 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Junnan Zhao, Cheng Xu | 2022-02-08 |
| 11031360 | Techniques for an inductor at a second level interface | Cheng Xu, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2021-06-08 |
| 10998120 | Method of making an inductor | William J. Lambert, Mihir K. Roy, Mathew J. Manusharow | 2021-05-04 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Timothy A. Gosselin, Prasanna Raghavan, Zhiguo Qian | 2020-11-24 |
| 10804188 | Electronic device including a lateral trace | Ying Wang, Cheng Xu, Chong Zhang, Junnan Zhao | 2020-10-13 |
| 10790159 | Semiconductor package substrate with through-hole magnetic core inductor using conductive paste | Cheng Xu, Chong Zhang, Junnan Zhao, Ying Wang | 2020-09-29 |
| 10777514 | Techniques for an inductor at a second level interface | Cheng Xu, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2020-09-15 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama +1 more | 2020-02-04 |
| 10396046 | Substrate assembly with magnetic feature | Robert L. Sankman | 2019-08-27 |
| 10361165 | Microelectronic substrate having embedded trace layers with integral attachment structures | — | 2019-07-23 |
| 10163557 | Helical plated through-hole package inductor | William J. Lambert, Mihir K. Roy, Mathew J. Manusharow | 2018-12-25 |
| 10123431 | Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill material | — | 2018-11-06 |
| 9953959 | Metal protected fan-out cavity | Kristof Darmawikarta, Robert Alan May, Amruthavalli Pallavi Alur, Sheng Li, Chong Zhang +2 more | 2018-04-24 |
| 9721880 | Integrated circuit package structures | Jimin Yao, Sanka Ganesan, Shawna M. Liff, Debendra Mallik | 2017-08-01 |
| 9653419 | Microelectronic substrate having embedded trace layers with integral attachment structures | — | 2017-05-16 |
| 9087696 | Systems and methods for non-periodic pulse partial melt film processing | James S. Im, Qiongying Hu, Ui-Jin Chung, Alexander B. Limanov | 2015-07-21 |