Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109583 | Method for creating alternate hardmask cap interconnect structure with increased overlay margin | Robert L. Bristol, Manish Chandhok, Jasmeet S. Chawla, Eungnak Han, Rami Hourani +3 more | 2018-10-23 |
| 9932671 | Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) | James M. Blackwell, Patricio E. Romero, Scott B. Clendenning, Grant Kloster, Harsono S. Simka +2 more | 2018-04-03 |
| 9899255 | Via blocking layer | Rami Hourani, Marie Krysak, Ruth A. Brain, Mark Bohr | 2018-02-20 |
| 9793163 | Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects | Robert L. Bristol, Richard E. Schenker, Paul A. Nyhus, Charles H. Wallace, Hui Jae Yoo | 2017-10-17 |
| 9754778 | Metallization of fluorocarbon-based dielectric for interconnects | David J. Michalak | 2017-09-05 |
| 9659869 | Forming barrier walls, capping, or alloys /compounds within metal lines | Christopher J. Jezewski, Alan M Meyers, Kanwal Jit Singh, Tejaswi K. Indukuri, James S. Clarke | 2017-05-23 |
| 9583389 | Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD) | Patricio E. Romero, Scott B. Clendenning, Jeanette M. Roberts | 2017-02-28 |
| 9530733 | Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions | Robert L. Bristol, James M. Blackwell, Scott B. Clendenning, Eungnak Han, Grant Kloster +3 more | 2016-12-27 |
| 9514983 | Cobalt based interconnects and methods of fabrication thereof | Christopher J. Jezewski, James S. Clarke, Tejaswi K. Indukuri, Daniel J. Zierath | 2016-12-06 |
| 9324652 | Method of creating a maskless air gap in back end interconnections with double self-aligned vias | Manish Chandhok, Hui Jae Yoo, Yan Borodovsky, David Shykind, Kevin Lin | 2016-04-26 |
| 9236292 | Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD) | Patricio E. Romero, Scott B. Clendenning, Jeanette M. Roberts | 2016-01-12 |
| 9111939 | Metallization of fluorocarbon-based dielectric for interconnects | David J. Michalak | 2015-08-18 |
| 9085461 | Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis | Valery M. Dubin, Gordon Holt, Brandon Barnett | 2015-07-21 |
| 8975138 | Method of creating a maskless air gap in back end interconnects with double self-aligned vias | Manish Chandhok, Hui Jae Yoo, Yan Borodovsky, David Shykind, Kevin Lin | 2015-03-10 |
| 8278121 | Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis | Valery M. Dubin, Gordon Holt, Brandon Barnett | 2012-10-02 |
| 8053774 | Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis | Valery M. Dubin, Gordon Holt, Brandon Barnett | 2011-11-08 |
| 7635503 | Composite metal films and carbon nanotube fabrication | Juan E. Dominguez, Valery M. Dubin, Michael Goldstein | 2009-12-22 |
| 7625817 | Method of fabricating a carbon nanotube interconnect structures | Valery M. Dubin, Juan E. Dominguez, Adrien LaVoie | 2009-12-01 |
| 7208327 | Metal oxide sensors and method of forming | Valery M. Dubin | 2007-04-24 |