Issued Patents All Time
Showing 151–175 of 271 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8779600 | Interlevel dielectric stack for interconnect structures | Griselda Bonilla, Alfred Grill, Thomas J. Haigh, Jr., Satyanarayana V. Nitta | 2014-07-15 |
| 8754520 | Formation of air gap with protection of metal lines | Takeshi Nogami, Shyng-Tsong Chen, David V. Horak, Shom Ponoth, Chih-Chao Yang | 2014-06-17 |
| 8664109 | Advanced low k cap film formation process for nano electronic devices | Alfred Grill, Joshua L. Herman, E. Todd Ryan, Hosadurga Shobha | 2014-03-04 |
| 8652950 | C-rich carbon boron nitride dielectric films for use in electronic devices | Alfred Grill, Thomas J. Haigh, Jr., Sanjay C. Mehta | 2014-02-18 |
| 8637412 | Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD | Alfred Grill, Thomas J. Haigh, Jr., Kelly Malone, Vishnubhai V. Patel, Hosadurga Shobha | 2014-01-28 |
| 8618183 | Materials containing voids with void size controlled on the nanometer scale | Stephen M. Gates, Alfred Grill, Deborah A. Neumayer, Vishnubhai V. Patel | 2013-12-31 |
| 8569166 | Methods of modifying interlayer adhesion | Francimar Schmitt, Li-Qun Xia, Shankar Venkataraman | 2013-10-29 |
| 8568475 | Spiraled commissure attachment for prosthetic valve | Netanel Benichou | 2013-10-29 |
| 8546956 | Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding | — | 2013-10-01 |
| 8536069 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Li-Qun Xia | 2013-09-17 |
| 8492880 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Li-Qun Xia | 2013-07-23 |
| 8476743 | C-rich carbon boron nitride dielectric films for use in electronic devices | Alfred Grill, Thomas J. Haigh, Jr., Sanjay C. Mehta | 2013-07-02 |
| 8454685 | Low profile transcatheter heart valve | Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon +3 more | 2013-06-04 |
| 8431436 | Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding | — | 2013-04-30 |
| 8399350 | Formation of air gap with protection of metal lines | Takeshi Nogami, Shyng-Tsong Chen, David V. Horak, Shom Ponoth, Chih-Chao Yang | 2013-03-19 |
| 8383507 | Method for fabricating air gap interconnect structures | Kaushik Chanda, Cathryn J. Christiansen, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth +1 more | 2013-02-26 |
| 8362596 | Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same | Stephan A. Cohen, Alfred Grill, Thomas J. Haigh, Jr., Xiao Hu Liu, Thomas M. Shaw +1 more | 2013-01-29 |
| 8357608 | Multi component dielectric layer | Stephen M. Gates, Alfred Grill, Satyanarayana V. Nitta | 2013-01-22 |
| 8299365 | Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures | Alfred Grill, Thomas J. Haigh, Jr., Hosadurga Shobha, Tuan A. Vo | 2012-10-30 |
| 8268411 | Materials containing voids with void size controlled on the nanometer scale | Stephen M. Gates, Alfred Grill, Deborah A. Neumayer, Vishnubhai V. Patel | 2012-09-18 |
| 8252051 | Method of implanting a prosthetic valve in a mitral valve with pulmonary vein anchoring | Mark Chau, Seung-Beom Yi, Philip P. Corso, Jr., Michael J. Popp, Kevin M. Golemo +1 more | 2012-08-28 |
| 8212337 | Advanced low k cap film formation process for nano electronic devices | Alfred Grill, Joshua L. Herman, E. Todd Ryan, Hosadurga Shobha | 2012-07-03 |
| 8120179 | Air gap interconnect structures and methods for forming the same | Kaushik Chanda, Cathryn J. Christiansen, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth +1 more | 2012-02-21 |
| 8101236 | Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Michael Lane, Qinghuang Lin +2 more | 2012-01-24 |
| 8097932 | Ultra low κ plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | Stephen M. Gates, Deborah A. Neumayer, Alfred Grill | 2012-01-17 |