SN

Son V. Nguyen

IBM: 166 patents #237 of 70,183Top 1%
EL Edwards Lifesciences: 60 patents #13 of 941Top 2%
HG HGST: 13 patents #117 of 1,677Top 7%
Applied Materials: 13 patents #1,030 of 7,310Top 15%
Globalfoundries: 6 patents #578 of 4,424Top 15%
ZY Zywie: 5 patents #1 of 4Top 25%
TE Tessera: 5 patents #92 of 271Top 35%
SO Sony: 4 patents #8,966 of 25,231Top 40%
SA Siemens Aktiengesellschaft: 4 patents #3,516 of 22,248Top 20%
Lam Research: 3 patents #812 of 2,128Top 40%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
AS Adeia Semiconductor Solutions: 1 patents #22 of 57Top 40%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Samsung: 1 patents #49,284 of 75,807Top 70%
AM AMD: 1 patents #5,683 of 9,279Top 65%
📍 Schenectady, NY: #4 of 1,353 inventorsTop 1%
🗺 New York: #76 of 115,490 inventorsTop 1%
Overall (All Time): #1,644 of 4,157,543Top 1%
271
Patents All Time

Issued Patents All Time

Showing 101–125 of 271 patents

Patent #TitleCo-InventorsDate
10177076 Air gap and air spacer pinch off Griselda Bonilla, Elbert E. Huang, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini 2019-01-08
10115629 Air gap spacer formation for nano-scale semiconductor devices Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Eric G. Liniger, Sanjay C. Mehta +2 more 2018-10-30
9974652 Low profile transcatheter heart valve Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon +3 more 2018-05-22
9974650 Prosthetic heart valve Diana Nguyen-Thien-Nhon, Timothy A. Geiser, Larry L. Wood, Dinesh L. Sirimanne, Tamir S. Levi +2 more 2018-05-22
9947581 Method of forming a copper based interconnect structure Daniel C. Edelstein, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha 2018-04-17
9947622 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Takeshi Nogami, Deepika Priyadarshini +1 more 2018-04-17
9947579 Copper interconnect structure with manganese oxide barrier layer Daniel C. Edelstein, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha 2018-04-17
9934963 Multilayer dielectric structures with graded composition for nano-scale semiconductor devices Deepika Priyadarshini 2018-04-03
9892961 Air gap spacer formation for nano-scale semiconductor devices Kangguo Cheng, Thomas J. Haigh, Jr., Juntao Li, Eric G. Liniger, Sanjay C. Mehta +2 more 2018-02-13
9859212 Multi-level air gap formation in dual-damascene structure Richard A. Conti, Jessica Dechene, Susan S. Fan, Jeffrey C. Shearer 2018-01-02
9793193 Air gap and air spacer pinch off Griselda Bonilla, Elbert E. Huang, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini 2017-10-17
9786760 Air gap and air spacer pinch off Griselda Bonilla, Elbert E. Huang, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini 2017-10-10
9735005 Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices Thomas J. Haigh, Jr., Deepika Priyadarshini, Hosadurga Shobha 2017-08-15
9711456 Composite manganese nitride/low-K dielectric cap Donald F. Canaperi, Takeshi Nogami, Deepika Priyadarshini 2017-07-18
9691705 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Takeshi Nogami, Deepika Priyadarshini +1 more 2017-06-27
9662204 Low profile transcatheter heart valve Ilia Hariton, Netanel Benichou, Yaacov Nitzan, Bella Felsen, Diana Nguyen-Thien-Nhon +3 more 2017-05-30
9636223 Systems and methods for placing a coapting member between valvular leaflets Vivian Khalil, Erin M. Spinner, Neil Zimmerman, Alexander J. Siegel 2017-05-02
9607825 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Deepika Priyadarshini, Hosadurga Shobha +1 more 2017-03-28
9601371 Interconnect structure with barrier layer Daniel C. Edelstein, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha 2017-03-21
9564386 Semiconductor package with structures for cooling fluid retention Wei Lin, Spyridon Skordas, Tuan A. Vo 2017-02-07
9558935 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Deepika Priyadarshini, Hosadurga Shobha +1 more 2017-01-31
9558934 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Deepika Priyadarshini, Hosadurga Shobha +1 more 2017-01-31
9536733 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Deepika Priyadarshini, Hosadurga Shobha +1 more 2017-01-03
9502288 Method of forming an interconnect structure Alfred Grill, Thomas J. Haigh, Jr., Hosadurga Shobha, Tuan A. Vo 2016-11-22
9472503 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Takeshi Nogami, Deepika Priyadarshini +1 more 2016-10-18