Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040411 | Advanced low k cap film formation process for nano electronic devices | Alfred Grill, Joshua L. Herman, Son V. Nguyen, Hosadurga Shobha | 2015-05-26 |
| 8664109 | Advanced low k cap film formation process for nano electronic devices | Alfred Grill, Joshua L. Herman, Son V. Nguyen, Hosadurga Shobha | 2014-03-04 |
| 8592312 | Method for depositing a conductive capping layer on metal lines | John A. Iacoponi | 2013-11-26 |
| 8481423 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Daniel C. Edelstein +8 more | 2013-07-09 |
| 8470706 | Methods to mitigate plasma damage in organosilicate dielectrics | John C. Arnold, Griselda Bonilla, William J. Cote, Geraud Jean-Michel Dubois, Daniel C. Edelstein +8 more | 2013-06-25 |
| 8324093 | Methods for fabricating semiconductor devices including azeotropic drying processes | — | 2012-12-04 |
| 8212346 | Method and apparatus for reducing semiconductor package tensile stress | Holger Schuehrer, Seung-Hyun Rhee | 2012-07-03 |
| 8212337 | Advanced low k cap film formation process for nano electronic devices | Alfred Grill, Joshua L. Herman, Son V. Nguyen, Hosadurga Shobha | 2012-07-03 |
| 7998856 | Interconnects with a dielectric sealant layer | — | 2011-08-16 |
| 7737052 | Advanced multilayer dielectric cap with improved mechanical and electrical properties | Ritwik Bhatia, Griselda Bonilla, Alfred Grill, Joshua L. Herman, Son V. Nguyen +1 more | 2010-06-15 |
| 7557035 | Method of forming semiconductor devices by microwave curing of low-k dielectric films | John A. Iacoponi | 2009-07-07 |
| 6919636 | Interconnects with a dielectric sealant layer | — | 2005-07-19 |