Issued Patents All Time
Showing 51–75 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8450184 | Thin substrate fabrication using stress-induced spalling | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2013-05-28 |
| 8381962 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Jae-Woong Nah, Kazushige Toriyama | 2013-02-26 |
| 8376207 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2013-02-19 |
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2012-11-20 |
| 8268282 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme | 2012-09-18 |
| 8247261 | Thin substrate fabrication using stress-induced substrate spalling | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2012-08-21 |
| 8241957 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2012-08-14 |
| 8162200 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2012-04-24 |
| 8156998 | Patterned metal thermal interface | Bruce K. Furman, Sushumna Iruvanti, Yves Martin, Da-Yuan Shih, Theodore G. van Kessel +1 more | 2012-04-17 |
| 8136714 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2012-03-20 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Henry A. Nye, III +2 more | 2011-09-27 |
| 8003512 | Structure of UBM and solder bumps and methods of fabrication | Luc Belanger, Marc A. Bergendahl, Ajay P. Giri, Valerie Oberson, Da-Yuan Shih | 2011-08-23 |
| 7980446 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2011-07-19 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2011-07-12 |
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Jae-Woong Nah, Kazushige Toriyama | 2011-04-26 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Henry A. Nye, III +2 more | 2011-04-12 |
| 7906420 | Method and apparatus for forming planar alloy deposits on a substrate | Peter A. Gruber, Jae-Woong Nah | 2011-03-15 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Madhusudan K. Iyengar, Yves Martin, Roger R. Schmidt, Da-Yuan Shih +2 more | 2011-03-01 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2011-02-08 |
| 7867842 | Method and apparatus for forming planar alloy deposits on a substrate | Peter A. Gruber, Jae-Woong Nah | 2011-01-11 |
| 7823278 | Method for fabricating electrical contact buttons | Gareth G. Hougham, Keith E. Fogel, Joanna Rosner, Sherif A. Goma, Joseph Zinter | 2010-11-02 |
| 7736152 | Land grid array fabrication using elastomer core and conducting metal shell or mesh | Gareth G. Hougham, Keith E. Fogel, Joseph Zinter | 2010-06-15 |
| 7731079 | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2010-06-08 |
| 7708909 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme | 2010-05-04 |