Issued Patents All Time
Showing 26–50 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9275867 | Method for improving quality of spalled material layers | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more | 2016-03-01 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Jae-Woong Nah | 2016-03-01 |
| 9263363 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme | 2016-02-16 |
| 9095081 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Jae-Woong Nah | 2015-07-28 |
| 9082762 | Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip | Sung Kwon Kang, Minhua Lu, Da-Yuan Shih | 2015-07-14 |
| 9040432 | Method for facilitating crack initiation during controlled substrate spalling | Stephen W. Bedell, Keith E. Fogel, Bahman Hekmatshoartabari, Devendra K. Sadana, Davood Shahrjerdi | 2015-05-26 |
| 8987132 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Jae-Woong Nah | 2015-03-24 |
| 8969174 | Fixed curvature force loading of mechanically spalled films | Stephen W. Bedell, Keith E. Fogel, Xiao Hu Liu, Devendra K. Sadana | 2015-03-03 |
| 8944306 | Forming metal preforms and metal balls | Peter A. Gruber, Jae-Woong Nah | 2015-02-03 |
| 8936961 | Removal of stressor layer from a spalled layer and method of making a bifacial solar cell using the same | Stephen W. Bedell, Keith E. Fogel, Bahman Hekmatshoartabari, Ning Li, Devendra K. Sadana +2 more | 2015-01-20 |
| 8916450 | Method for improving quality of spalled material layers | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more | 2014-12-23 |
| 8841203 | Method for forming two device wafers from a single base substrate utilizing a controlled spalling process | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana, Davood Shahrjerdi | 2014-09-23 |
| 8833636 | Forming an array of metal balls or shapes on a substrate | Peter A. Gruber, Jae-Woong Nah | 2014-09-16 |
| 8828860 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Jae-Woong Nah | 2014-09-09 |
| 8754666 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2014-06-17 |
| 8748296 | Edge-exclusion spalling method for improving substrate reusability | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana, Davood Shahrjerdi, Norma E. Sosa Cortes | 2014-06-10 |
| 8709914 | Method for controlled layer transfer | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2014-04-29 |
| 8709957 | Spalling utilizing stressor layer portions | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Ibrahim Alhomoudi | 2014-04-29 |
| 8679943 | Fixed curvature force loading of mechanically spalled films | Stephen W. Bedell, Keith E. Fogel, Xiao Hu Liu, Devendra K. Sadana | 2014-03-25 |
| 8604623 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme | 2013-12-10 |
| 8561880 | Forming metal preforms and metal balls | Peter A. Gruber, Jae-Woong Nah | 2013-10-22 |
| 8523046 | Forming an array of metal balls or shapes on a substrate | Peter A. Gruber, Jae-Woong Nah | 2013-09-03 |
| 8492262 | Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates | Peter A. Gruber, Jae-Woong Nah | 2013-07-23 |
| 8491772 | Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2013-07-23 |
| 8486250 | Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2013-07-16 |