Issued Patents All Time
Showing 76–100 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7694719 | Patterned metal thermal interface | Bruce K. Furman, Sushumna Iruvanti, Yves Martin, Da-Yuan Shih, Theodore G. van Kessel +1 more | 2010-04-13 |
| 7648369 | Interposer with electrical contact button and method | Gareth G. Hougham, Keith E. Fogel, Joanna Rosner, Sherif A. Goma, Joseph Zinter | 2010-01-19 |
| 7556979 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2009-07-07 |
| 7538565 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2009-05-26 |
| 7523852 | Solder interconnect structure and method using injection molded solder | Stephen L. Buchwalter, Claudius Feger, Peter A. Gruber, Sung Kwon Kang, Da-Yuan Shih | 2009-04-28 |
| 7495342 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih | 2009-02-24 |
| 7479014 | Land grid array fabrication using elastomer core and conducting metal shell or mesh | Gareth G. Hougham, Keith E. Fogel, Joseph Zinter | 2009-01-20 |
| 7417315 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, S. Jay Chey, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes +2 more | 2008-08-26 |
| 7410833 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Henry A. Nye, III +2 more | 2008-08-12 |
| 7368924 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2008-05-06 |
| 7351360 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme | 2008-04-01 |
| 7332922 | Method for fabricating a structure for making contact with a device | Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih | 2008-02-19 |
| 7282945 | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih | 2007-10-16 |
| 7276919 | High density integral test probe | Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2007-10-02 |
| 7172431 | Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof | Brian S. Beaman, George Liang-Tai Chiu, Keith E. Fogel, Daniel Peter Morris, Da-Juan Shih | 2007-02-06 |
| 7137827 | Interposer with electrical contact button and method | Gareth G. Hougham, Keith E. Fogel, Joanna Rosner, Sherif A. Goma, Joseph Zinter | 2006-11-21 |
| 6891360 | Plated probe structure | Brian S. Beaman, Keith E. Fogel, Eugene J. O'Sullivan, Da-Yuan Shih, Ho-Ming Tong | 2005-05-10 |
| 6880245 | Method for fabricating a structure for making contact with an IC device | Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih | 2005-04-19 |
| 6722032 | Method of forming a structure for electronic devices contact locations | Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih | 2004-04-20 |
| 6708403 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih | 2004-03-23 |
| 6526655 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih | 2003-03-04 |
| 6528984 | Integrated compliant probe for wafer level test and burn-in | Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih | 2003-03-04 |
| 6523255 | Process and structure to repair damaged probes mounted on a space transformer | Da-Yuan Shih, Keith E. Fogel, Brian S. Beaman | 2003-02-25 |
| 6525551 | Probe structures for testing electrical interconnections to integrated circuit electronic devices | Brian S. Beaman, Keith E. Fogel, Eugene J. O'Sullivan, Da-Yuan Shih | 2003-02-25 |
| 6452406 | Probe structure having a plurality of discrete insulated probe tips | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2002-09-17 |