PL

Paul A. Lauro

IBM: 117 patents #431 of 70,183Top 1%
KT King Abdulaziz City For Science And Technology: 7 patents #22 of 573Top 4%
Globalfoundries: 5 patents #673 of 4,424Top 20%
UL Ultratech: 1 patents #58 of 110Top 55%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
📍 Brewster, NY: #1 of 146 inventorsTop 1%
🗺 New York: #347 of 115,490 inventorsTop 1%
Overall (All Time): #9,325 of 4,157,543Top 1%
124
Patents All Time

Issued Patents All Time

Showing 101–124 of 124 patents

Patent #TitleCo-InventorsDate
6334247 High density integrated circuit apparatus, test probe and methods of use thereof Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 2002-01-01
6332270 Method of making high density integral test probe Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 2001-12-25
6329827 High density cantilevered probe for electronic devices Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih 2001-12-11
6300780 High density integrated circuit apparatus, test probe and methods of use thereof Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 2001-10-09
6295729 Angled flying lead wire bonding process Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih 2001-10-02
6286208 Interconnector with contact pads having enhanced durability Da-Yuan Shih, Keith E. Fogel, Brian S. Beaman, Maurice Heathcote Norcott 2001-09-11
6206273 Structures and processes to create a desired probetip contact geometry on a wafer test probe Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih 2001-03-27
6104201 Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 2000-08-15
6078500 Pluggable chip scale package Brian S. Beaman, Keith E. Fogel, Da-Yuan Shih 2000-06-20
6062879 High density test probe with rigid surface structure Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih 2000-05-16
6054651 Foamed elastomers for wafer probing applications and interposer connectors Keith E. Fogel, James L. Hedrick, Yun-Hsin Liao, Da-Yuan Shih 2000-04-25
5914614 High density cantilevered probe for electronic devices Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih 1999-06-22
5838160 Integral rigid chip test probe Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 1998-11-17
5821763 Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 1998-10-13
5810607 Interconnector with contact pads having enhanced durability Da-Yuan Shih, Keith E. Fogel, Brian S. Beaman, Maurice Heathcote Norcott 1998-09-22
5811982 High density cantilevered probe for electronic devices Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yaun Shih 1998-09-22
5785538 High density test probe with rigid surface structure Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih 1998-07-28
5635846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer Brian S. Beaman, Keith E. Fogel, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker 1997-06-03
5531022 Method of forming a three dimensional high performance interconnection package Brain S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Maurice Heathcote Norcott +4 more 1996-07-02
5490518 Leg length analyzer Roger Russo 1996-02-13
5371654 Three dimensional high performance interconnection package Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Maurice Heathcote Norcott +4 more 1994-12-06
5185073 Method of fabricating nendritic materials Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more 1993-02-09
5137461 Separable electrical connection technology Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more 1992-08-11
5053272 Optical storage device Kie Y. Ahn, Jungihl Kim, George F. Walker 1991-10-01