DC

Dureseti Chidambarrao

IBM: 223 patents #132 of 70,183Top 1%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
MG Mentor Graphics: 2 patents #191 of 698Top 30%
Samsung: 2 patents #37,631 of 75,807Top 50%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Weston, CT: #1 of 210 inventorsTop 1%
🗺 Connecticut: #16 of 34,797 inventorsTop 1%
Overall (All Time): #2,436 of 4,157,543Top 1%
230
Patents All Time

Issued Patents All Time

Showing 126–150 of 230 patents

Patent #TitleCo-InventorsDate
7504697 Rotational shear stress for charge carrier mobility modification 2009-03-17
7495291 Strained dislocation-free channels for CMOS and method of manufacture Omer H. Dokumaci 2009-02-24
7488658 Stressed semiconductor device structures having granular semiconductor material Bruce B. Doris, Michael P. Belyansky, Diane C. Boyd, Oleg Gluschenkov 2009-02-10
7485519 After gate fabrication of field effect transistor having tensile and compressive regions William K. Henson, Yaocheng Liu 2009-02-03
7476938 Transistor having dielectric stressor elements at different depths from a semiconductor surface for applying shear stress Brian J. Greene, Kern Rim 2009-01-13
7473594 Raised STI structure and superdamascene technique for NMOSFET performance enhancement with embedded silicon carbon Ashima B. Chakravarti, Judson R. Holt, Yaocheng Liu, Kern Rim 2009-01-06
7468538 Strained silicon on a SiGe on SOI substrate Kangguo Cheng 2008-12-23
7462916 Semiconductor devices having torsional stresses Richard Q. Williams, John J. Ellis-Monaghan, Shreesh Narasimha, Edward J. Nowak, John J. Pekarik 2008-12-09
7462522 Method and structure for improving device performance variation in dual stress liner technology Brian J. Greene 2008-12-09
7452784 Formation of improved SOI substrates using bulk semiconductor wafers William K. Henson, Kern Rim, Hsingjen Wann, Hung Y. Ng 2008-11-18
7449378 Structure and method for improved stress and yield in pFETS with embedded SiGe source/drain regions Brian J. Greene 2008-11-11
7446062 Device having dual etch stop liner and reformed silicide layer and related methods Ying Li, Rajeev Malik, Shreesh Narasimha 2008-11-04
7446395 Device having dual etch stop liner and protective layer Ying Li, Rajeev Malik, Shreesh Narasimha 2008-11-04
7446350 Embedded silicon germanium using a double buried oxide silicon-on-insulator wafer Huajie Chen, Dominic J. Schepis, Henry K. Utomo 2008-11-04
7439123 Low resistance contact semiconductor device structure William K. Henson 2008-10-21
7436029 High performance CMOS device structures and method of manufacture Bruce B. Doris, Suk Hoon Ku 2008-10-14
7410846 Method for reduced N+ diffusion in strained Si on SiGe substrate Omer H. Dokumaci 2008-08-12
7405436 Stressed field effect transistors on hybrid orientation substrate Judson R. Holt, Meikei Ieong, Oiging C. Ouyang, Siddhartha Panda 2008-07-29
7397081 Sidewall semiconductor transistors Huilong Zhu, Lawrence A. Clevenger, Omer H. Dokumaci, Kaushik A. Kumar, Carl Radens 2008-07-08
7396714 Method of making strained semiconductor transistors having lattice-mismatched semiconductor regions underlying source and drain regions Huajie Chen, Oleg Gluschenkov, An Steegen, Haining Yang 2008-07-08
7388259 Strained finFET CMOS device structures Bruce B. Doris, Meikei Ieong, Jack A. Mandelman 2008-06-17
7374987 Stress inducing spacers Omer H. Dokumaci, Bruce B. Doris, Jack A. Mandelman, Xavier Baie 2008-05-20
7361973 Embedded stressed nitride liners for CMOS performance improvement Omer H. Dokumaci 2008-04-22
7358551 Structure and method for improved stress and yield in pFETs with embedded SiGe source/drain regions Brian J. Greene 2008-04-15
7348635 Device having enhanced stress state and related methods Ying Li, Rajeev Malik, Shreesh Narasimha, Haining Yang, Huilong Zhu 2008-03-25