Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714339 | Selectively deposited parylene masks and methods related thereto | Fei Wang, Miaojun Wang, Shishi Jiang, Abhijit Basu Mallick, Robert Jan Visser | 2020-07-14 |
| 10699903 | Two-step process for gapfilling high aspect ratio trenches with amorphous silicon film | Shishi Jiang, Rui Cheng, Abhijit Basu Mallick | 2020-06-30 |
| 10643841 | Surface modification to improve amorphous silicon gapfill | Shishi Jiang, Abhijit Basu Mallick | 2020-05-05 |
| 10636669 | Seam healing using high pressure anneal | Yihong Chen, Rui Cheng, Abhijit Basu Mallick, Shishi Jiang, Yong Wu +2 more | 2020-04-28 |
| 10626495 | Bottom-up growth of silicon oxide and silicon nitride using sequential deposition-etch-treat processing | Rui Cheng, Abhijit Basu Mallick | 2020-04-21 |
| 10615050 | Methods for gapfill in high aspect ratio structures | Rui Cheng, Abhijit Basu Mallick, Yihong Chen | 2020-04-07 |
| 10580642 | Two-step process for silicon gapfill | Abhijit Basu Mallick, Shishi Jiang | 2020-03-03 |
| 10529585 | Dry stripping of boron carbide hardmask | Shishi Jiang, Abhijit Basu Mallick, Kurtis Leschkies | 2020-01-07 |
| 10529568 | PECVD tungsten containing hardmask films and methods of making | Susmit Singha Roy, Rui Cheng, Abhijit Basu Mallick | 2020-01-07 |
| 10483102 | Surface modification to improve amorphous silicon gapfill | Shishi Jiang, Abhijit Basu Mallick | 2019-11-19 |
| 10460933 | Two-step process for gapfilling high aspect ratio trenches with amorphous silicon film | Shishi Jiang, Rui Cheng, Abhijit Basu Mallick | 2019-10-29 |
| 10373823 | Deployment of light energy within specific spectral bands in specific sequences for deposition, treatment and removal of materials | Swaminathan Srinivasan, Atashi Basu, Khokan Chandra Paul, Diwakar Kedlaya | 2019-08-06 |
| 10347488 | Titanium compound based hard mask films | Rui Cheng, Wei V. Tang, Abhijit Basu Mallick, Srinivas Gandikota | 2019-07-09 |
| 10319624 | Oxidative volumetric expansion of metals and metal containing compounds | Susmit Singha Roy, Yihong Chen, Kelvin Chan, Abhijit Basu Mallick, Srinivas Gandikota | 2019-06-11 |
| 10312137 | Hardmask layer for 3D NAND staircase structure in semiconductor applications | Eswaranand Venkatasubramanian, Susmit Singha Roy, Abhijit Basu Mallick | 2019-06-04 |
| 10280507 | Flowable gapfill using solvents | Ranga Rao Arnepalli, Darshan Thakare, Abhijit Basu Mallick, Robert Jan Visser, Prerna Goradia +1 more | 2019-05-07 |
| 10192775 | Methods for gapfill in high aspect ratio structures | Ludovic Godet, Rui Cheng, Erica Chen, Ziqing Duan, Abhijit Basu Mallick +1 more | 2019-01-29 |
| 10176980 | Selective deposition of silicon oxide films | Abhijit Basu Mallick | 2019-01-08 |
| 10128150 | Process of filling the high aspect ratio trenches by co-flowing ligands during thermal CVD | Rui Cheng, Kelvin Chan, Abhijit Basu Mallick | 2018-11-13 |
| 10074534 | Ultra-conformal carbon film deposition | Swayambhu Prasad Behera, Shahid Shaikh, Mandar B. Pandit, Tersem Summan, Patrick Reilly +4 more | 2018-09-11 |
| 10017856 | Flowable gapfill using solvents | Ranga Rao Arnepalli, Darshan Thakare, Abhijit Basu Mallick, Robert Jan Visser, Prerna Goradia +1 more | 2018-07-10 |
| 10014174 | Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning | Bencherki Mebarki, Li Yan Miao, Deenesh Padhi, Bok Hoen Kim, Christopher Dennis Bencher | 2018-07-03 |
| 9865459 | Plasma treatment to improve adhesion between hardmask film and silicon oxide film | Rui Cheng, Abhijit Basu Mallick | 2018-01-09 |
| 9721784 | Ultra-conformal carbon film deposition | Swayambhu Prasad Behera, Shahid Shaikh, Mandar B. Pandit, Tersem Summan, Patrick Reilly +4 more | 2017-08-01 |
| 9659771 | Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning | Bencherki Mebarki, Li Yan Miao, Deenesh Padhi, Bok Hoen Kim, Christopher Dennis Bencher | 2017-05-23 |