Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7709396 | Integral patterning of large features along with array using spacer mask patterning process flow | Jing Tang | 2010-05-04 |
| 7608300 | Methods and devices to reduce defects in dielectric stack structures | Lee Luo | 2009-10-27 |
| 7598183 | Bi-layer capping of low-K dielectric films | Ping Xu | 2009-10-06 |
| 7588990 | Dynamic surface annealing of implanted dopants with low temperature HDPCVD process for depositing a high extinction coefficient optical absorber layer | Vijay Parihar, Rajesh Kanuri, Marlon Edward Menezes | 2009-09-15 |
| 7547621 | LPCVD gate hard mask | Rajesh Kanuri, Chorng-Ping Chang, Hoiman Raymond Hung | 2009-06-16 |
| 7507677 | Removable amorphous carbon CMP stop | — | 2009-03-24 |
| 7365014 | Reticle fabrication using a removable hard mask | Melvin Montgomery, Alexander Buxbaum, Yung-Hee Yvette Lee, Jian Ding, Gilad Almogy +1 more | 2008-04-29 |
| 7335462 | Method of depositing an amorphous carbon layer | Kevin Fairbairn, Michael R. Rice, Timothy Weidman, Christopher S. Ngai, Ian Latchford +1 more | 2008-02-26 |
| 7332262 | Photolithography scheme using a silicon containing resist | Ian Latchford, Yuxiang Wang, Mario D. Silvetti | 2008-02-19 |
| 7223526 | Method of depositing an amorphous carbon layer | Kevin Fairbairn, Michael R. Rice, Timothy Weidman, Christopher S. Ngai, Ian Latchford +1 more | 2007-05-29 |
| 7148156 | Removable amorphous carbon CMP stop | — | 2006-12-12 |
| 7105442 | Ashable layers for reducing critical dimensions of integrated circuit features | Hongching Shan, Kenny L. Doan, Jingbao Liu, Michael Barnes, Hong Dang Nguyen +4 more | 2006-09-12 |
| 7105460 | Nitrogen-free dielectric anti-reflective coating and hardmask | Bok Hoen Kim, Sudha Rathi, Sang-Hoon Ahn, Yuxiang Wang, Hichem M'Saad +1 more | 2006-09-12 |
| 6967072 | Photolithography scheme using a silicon containing resist | Ian Latchford, Yuxiang Wang, Mario D. Silvetti | 2005-11-22 |
| 6951826 | Silicon carbide deposition for use as a low dielectric constant anti-reflective coating | Joe Feng, Mei-Yee Shek, Chris Ngai, Judy H. Huang | 2005-10-04 |
| 6946401 | Plasma treatment for copper oxide reduction | Judy H. Huang, Sudha Rathi, Christopher S. Ngai, Bok Hoen Kim | 2005-09-20 |
| 6927178 | Nitrogen-free dielectric anti-reflective coating and hardmask | Bok Hoen Kim, Sudha Rathi, Sang-Hoon Ahn, Yuxiang Wang, Hichem M'Saad +4 more | 2005-08-09 |
| 6924191 | Method for fabricating a gate structure of a field effect transistor | Wei Liu, Thorsten Lill, David Mui | 2005-08-02 |
| 6913868 | Conductive bi-layer e-beam resist with amorphous carbon | Ian Latchford | 2005-07-05 |
| 6852647 | Removable amorphous carbon CMP stop | — | 2005-02-08 |
| 6853043 | Nitrogen-free antireflective coating for use with photolithographic patterning | Wendy H. Yeh, Sang-Hoon Ahn, Hichem M'Saad, Sudha Rathi | 2005-02-08 |
| 6841341 | Method of depositing an amorphous carbon layer | Kevin Fairbairn, Michael R. Rice, Timothy Weidman, Christopher S. Ngai, Ian Latchford +1 more | 2005-01-11 |
| 6797646 | Method of nitrogen doping of fluorinated silicate glass (FSG) while removing the photoresist layer | Christopher S. Ngai, Joe Feng, Peter Chen | 2004-09-28 |
| 6780753 | Airgap for semiconductor devices | Ian Latchford, Michael D. Armacost, Timothy Weidman, Christopher S. Ngai | 2004-08-24 |
| 6700202 | Semiconductor device having reduced oxidation interface | Judy H. Huang, Sudha Rathi, Christopher S. Ngai, Bok Hoen Kim | 2004-03-02 |