| 12387975 |
Thermal process chamber lid with backside pumping |
Dien-Yeh Wu, Wei V. Tang, Yixiong Yang, Bo Wang |
2025-08-12 |
| 12054826 |
ALD cycle time reduction using process chamber lid with tunable pumping |
Muhannad Mustafa, Muhammad M. Rasheed, Mario D. Sanchez |
2024-08-06 |
| 11767590 |
ALD cycle time reduction using process chamber lid with tunable pumping |
Muhannad Mustafa, Muhammad M. Rasheed, Mario D. Sanchez |
2023-09-26 |
| 11715667 |
Thermal process chamber lid with backside pumping |
Dien-Yeh Wu, Wei V. Tang, Yixiong Yang, Bo Wang |
2023-08-01 |
| 11335591 |
Thermal process chamber lid with backside pumping |
Dien-Yeh Wu, Wei V. Tang, Yixiong Yang, Bo Wang |
2022-05-17 |
| 10407771 |
Atomic layer deposition chamber with thermal lid |
Faruk Gungor, Dien-Yeh Wu, Vikas Jangra, Muhammad M. Rasheed, Wei V. Tang +6 more |
2019-09-10 |
| 9892941 |
Multi-zone resistive heater |
Binh Tran, Alexander Tam, Jacob Smith, R. Suryanarayanan Iyer, Joseph Yudovsky +1 more |
2018-02-13 |
| 9312154 |
CVD apparatus for improved film thickness non-uniformity and particle performance |
Binh Tran, Bernard L. Hwang, Son T. Nguyen, Anh N. Nguyen, Sean M. Seutter +1 more |
2016-04-12 |
| 9202674 |
Plasma reactor with a ceiling electrode supply conduit having a succession of voltage drop elements |
Olkan Cuvalci, Yu Chang, William Kuang, Seshadri Ganguli |
2015-12-01 |
| 8618446 |
Substrate support with substrate heater and symmetric RF return |
Yu-Chia Chang, Gwo-Chuan Tzu, William Kuang, Olkan Cuvalci |
2013-12-31 |
| 6617553 |
Multi-zone resistive heater |
Henry Ho, Xiaoxiong Yuan |
2003-09-09 |
