Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159825 | Dielectric-to-metal adhesion promotion material | Suddhasattwa Nad, Marcel Wall, Darko Grujicic | 2024-12-03 |
| 12148704 | Electrical interconnect bridge | Srinivas V. Pietambaram | 2024-11-19 |
| 12125793 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2024-10-22 |
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2024-09-10 |
| 12087695 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2024-09-10 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2024-05-21 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Robert L. Sankman, Gang Duan, Debendra Mallik | 2024-05-07 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2024-04-30 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Jung Kyu Han, Hongxia Feng, Xiaoying Guo | 2024-04-09 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11901248 | Embedded die architecture and method of making | Robert L. Sankman, Robert Alan May, Srinivas V. Pietambaram, Bharat P. Penmecha | 2024-02-13 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Sri Ranga Sai Boyapati | 2024-01-02 |