Issued Patents 2024
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176223 | Integrated circuit package supports | Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2024-12-24 |
| 12165994 | Radio frequency antennas and waveguides for communication between integrated circuit devices | Aleksandar Aleksov, Benjamin Duong, Telesphor Kamgaing, Miranda Ngan, Srinivas V. Pietambaram | 2024-12-10 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Robert L. Sankman +1 more | 2024-07-23 |
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama | 2024-06-18 |
| 11948898 | Etch barrier for microelectronic packaging conductive structures | Srinivas V. Pietambaram, Hongxia Feng, Xiaoying Guo, Benjamin Duong | 2024-04-02 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Suddhasattwa Nad, Vahidreza Parichehreh, Veronica Strong +1 more | 2024-03-26 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2024-03-12 |
| 11929212 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Sameer Paital, Gang Duan, Srinivas V. Pietambaram | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11908821 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Sri Ranga Sai Boyapati, Hiroki Tanaka, Robert Alan May | 2024-02-20 |
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-20 |
| 11901296 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati | 2024-02-13 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Eyal Fayneh, Ofir Degani +2 more | 2024-02-06 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Robert L. Sankman +1 more | 2024-02-06 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Robert Alan May, Hiroki Tanaka, Rahul N. Manepalli, Sri Ranga Sai Boyapati | 2024-01-02 |