Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Islam A. Salama, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Islam A. Salama, Kristof Darmawikarta | 2024-06-18 |