| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2024-12-24 |
$17,261,000 |
| 12176223 |
Integrated circuit package supports |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov |
2024-12-24 |
$17,261,000 |
| 12148703 |
EMIB patch on glass laminate substrate |
Robert L. Sankman |
2024-11-19 |
$25,575,000 |
| 12046560 |
Microelectronic device with embedded die substrate on interposer |
Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more |
2024-07-23 |
$20,446,000 |
| 12040276 |
Device and method of very high density routing used with embedded multi-die interconnect bridge |
Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta |
2024-07-16 |
$26,089,000 |
| 12014989 |
Device and method of very high density routing used with embedded multi-die interconnect bridge |
Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta |
2024-06-18 |
$26,452,000 |
| 11948848 |
Subtractive etch resolution implementing a functional thin metal resist |
Jeremy Ecton, Oscar Ojeda, Leonel Arana, Suddhasattwa Nad, Hiroki Tanaka +1 more |
2024-04-02 |
$34,819,000 |
| 11935857 |
Surface finishes with low RBTV for fine and mixed bump pitch architectures |
Kristof Darmawaikarta, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Steve Cho +7 more |
2024-03-19 |
$28,784,000 |
| 11929330 |
Lithographic cavity formation to enable EMIB bump pitch scaling |
Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more |
2024-03-12 |
$37,196,000 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more |
2024-03-05 |
$29,696,000 |
| 11908821 |
Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Hiroki Tanaka |
2024-02-20 |
$26,968,000 |
| 11908802 |
Multi-chip package with high density interconnects |
Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Sri Ranga Sai Boyapati |
2024-02-20 |
$26,968,000 |
| 11901296 |
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate |
Kristof Darmawikarta, Sri Ranga Sai Boyapati |
2024-02-13 |
$18,546,000 |
| 11901248 |
Embedded die architecture and method of making |
Robert L. Sankman, Rahul N. Manepalli, Srinivas V. Pietambaram, Bharat P. Penmecha |
2024-02-13 |
$18,546,000 |
| 11894311 |
Microelectronic device with embedded die substrate on interposer |
Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more |
2024-02-06 |
$35,892,000 |
| 11862619 |
Patch accommodating embedded dies having different thicknesses |
Srinivas V. Pietambaram, Kristof Darmawikarta, Hiroki Tanaka, Rahul N. Manepalli, Sri Ranga Sai Boyapati |
2024-01-02 |
$30,016,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2024-01-02 |
$30,016,000 |
