Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176223 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2024-12-24 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-07-23 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Srinivas V. Pietambaram, Steve Cho +7 more | 2024-03-19 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11908821 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May | 2024-02-20 |
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2024-02-20 |
| 11901296 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2024-02-13 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2024-02-06 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-02-06 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Rahul N. Manepalli | 2024-01-02 |