| 12183596 |
Low cost package warpage solution |
Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita |
2024-12-31 |
| 12181710 |
Photonic integrated circuit packaging architecture |
Omkar G. Karhade, Xiaoqian Li, Tarek A. Ibrahim, Ravindranath V. Mahajan |
2024-12-31 |
| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Mitul Modi, Manish Dubey +1 more |
2024-12-24 |
| 12174436 |
Package expanded beam connector for on-package optics |
Wesley B. Morgan, Srikant Nekkanty, Todd Coons, Gregorio R. Murtagian, Xiaoqian Li +1 more |
2024-12-24 |
| 12148742 |
Active bridge enabled co-packaged photonic transceiver |
Thomas Liljeberg, Andrew C. Alduino, Ravindranath V. Mahajan, Ling Liao, Kenneth M. Brown +2 more |
2024-11-19 |
| 12113023 |
Microelectronic structures including bridges |
Omkar G. Karhade |
2024-10-08 |
| 12061371 |
Patch on interposer architecture for low cost optical co-packaging |
Xiaoqian Li, Omkar G. Karhade, Ravindranath V. Mahajan |
2024-08-13 |
| 12044888 |
Silicon groove architectures and manufacturing processes for passive alignment in a photonics die |
Omkar G. Karhade, Xiaoqian Li, Sujit Sharan |
2024-07-23 |
| 12027448 |
Open cavity bridge power delivery architectures and processes |
Omkar G. Karhade, Mitul Modi, Sairam Agraharam, Digvijay A. Raorane |
2024-07-02 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Omkar G. Karhade, Yikang Deng, Wei-Lun Kane Jen +6 more |
2024-03-05 |
| 11887962 |
Microelectronic structures including bridges |
Omkar G. Karhade, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi +6 more |
2024-01-30 |