Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Amruthavalli Pallavi Alur | 2024-04-09 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11862597 | Asymmetric stackup structure for SoC package substrates | Taegui Kim, Yifan Kao, Jun Chung Hsu | 2024-01-02 |