Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Jesse C. Jones +1 more | 2024-03-12 |
| 11923307 | Microelectronic structures including bridges | Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11923312 | Patternable die attach materials and processes for patterning | Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |