Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Yosuke Kanaoka, Dilan Seneviratne | 2024-09-10 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |