Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Dilan Seneviratne | 2024-09-10 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Hongxia Feng +10 more | 2024-03-05 |