| 12159825 |
Dielectric-to-metal adhesion promotion material |
Suddhasattwa Nad, Marcel Wall, Darko Grujicic |
2024-12-03 |
| 12148704 |
Electrical interconnect bridge |
Srinivas V. Pietambaram |
2024-11-19 |
| 12125793 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications |
Srinivas V. Pietambaram, Gang Duan |
2024-10-22 |
| 12087700 |
Embedded die microelectronic device with molded component |
Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne |
2024-09-10 |
| 12087695 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications |
Srinivas V. Pietambaram, Gang Duan |
2024-09-10 |
| 12068172 |
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages |
Tarek A. Ibrahim, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez |
2024-08-20 |
| 11990427 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2024-05-21 |
| 11978685 |
Glass core patch with in situ fabricated fan-out layer to enable die tiling applications |
Srinivas V. Pietambaram, Robert L. Sankman, Gang Duan, Debendra Mallik |
2024-05-07 |
| 11973041 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2024-04-30 |
| 11955448 |
Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches |
Jung Kyu Han, Hongxia Feng, Xiaoying Guo |
2024-04-09 |
| 11935805 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2024-03-19 |
| 11923312 |
Patternable die attach materials and processes for patterning |
Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more |
2024-03-05 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more |
2024-03-05 |
| 11901248 |
Embedded die architecture and method of making |
Robert L. Sankman, Robert Alan May, Srinivas V. Pietambaram, Bharat P. Penmecha |
2024-02-13 |
| 11862619 |
Patch accommodating embedded dies having different thicknesses |
Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Sri Ranga Sai Boyapati |
2024-01-02 |