| 12183596 |
Low cost package warpage solution |
Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita |
2024-12-31 |
| 12181710 |
Photonic integrated circuit packaging architecture |
Xiaoqian Li, Tarek A. Ibrahim, Ravindranath V. Mahajan, Nitin A. Deshpande |
2024-12-31 |
| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi, Manish Dubey +1 more |
2024-12-24 |
| 12148744 |
Optical multichip package with multiple system-on-chip dies |
Zhichao Zhang, Kemal Aygun, Suresh Pothukuchi, Xiaoqian Li |
2024-11-19 |
| 12119326 |
Microelectronic structures including bridges |
Bohan Shan |
2024-10-15 |
| 12113023 |
Microelectronic structures including bridges |
Nitin A. Deshpande |
2024-10-08 |
| 12068222 |
Dummy die structures of a packaged integrated circuit device |
Mitul Modi, Joseph Van Nausdle, Edvin Cetegen, Nicholas S. Haehn, Vaibhav Agrawal +4 more |
2024-08-20 |
| 12061371 |
Patch on interposer architecture for low cost optical co-packaging |
Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan |
2024-08-13 |
| 12044888 |
Silicon groove architectures and manufacturing processes for passive alignment in a photonics die |
Xiaoqian Li, Nitin A. Deshpande, Sujit Sharan |
2024-07-23 |
| 12027448 |
Open cavity bridge power delivery architectures and processes |
Mitul Modi, Sairam Agraharam, Nitin A. Deshpande, Digvijay A. Raorane |
2024-07-02 |
| 12003023 |
In-package 3D antenna |
Zhenguo Jiang, Srichaitra Chavali, Zhichao Zhang, Jimin Yao, Stephen Andrew Smith +2 more |
2024-06-04 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more |
2024-03-05 |
| 11887962 |
Microelectronic structures including bridges |
Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi +6 more |
2024-01-30 |