Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130482 | Hydrophobic feature to control adhesive flow | Bassam M. Ziadeh, Jingyi Huang, Yiqun Bai, Ziyin Lin, Vipul V. Mehta | 2024-10-29 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn, Vaibhav Agrawal +4 more | 2024-08-20 |